
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于公司及子公司开展融资租赁业务的公告 | 2025-08-26 | Chinese | |
| 关于控股股东为公司及子公司开展融资租赁业务及申请银行授信提供关联担保的公告 | 2025-08-26 | Chinese | |
| 2025年半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2025-08-26 | Chinese | |
| 2025年半年度报告 | 2025-08-26 | Chinese | |
| 2025年半年度报告摘要 | 2025-08-26 | Chinese | |
| 2025年半年度报告披露提示性公告 | 2025-08-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37288318 | 关于公司及子公司开展融资租赁业务的公告 | 2025-08-26 | Chinese | ||
| 37288308 | 关于控股股东为公司及子公司开展融资租赁业务及申请银行授信提供关联担保的公告 | 2025-08-26 | Chinese | ||
| 37288303 | 2025年半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2025-08-26 | Chinese | ||
| 37288297 | 2025年半年度报告 | 2025-08-26 | Chinese | ||
| 37288291 | 2025年半年度报告摘要 | 2025-08-26 | Chinese | ||
| 37288281 | 2025年半年度报告披露提示性公告 | 2025-08-26 | Chinese | ||
| 37288274 | 董事会决议公告 | 2025-08-26 | Chinese | ||
| 37288273 | 关于为子公司开展融资租赁业务及申请银行授信提供担保的公告 | 2025-08-26 | Chinese | ||
| 37288267 | 关于公司及子公司向银行申请综合授信额度的公告 | 2025-08-26 | Chinese | ||
| 37288261 | 关于控股股东部分股票解除质押及质押展期的公告 | 2025-08-20 | Chinese | ||
| 37288250 | 第五届董事会第十九次会议决议公告 | 2025-08-19 | Chinese | ||
| 37288243 | 关于收购青岛展诚科技有限公司56.24%股权的公告 | 2025-08-19 | Chinese | ||
| 37288235 | 关于控股子公司MEMS-OCS通过验证并启动试产的公告 | 2025-08-15 | Chinese | ||
| 37288225 | 关于全资子公司变更注册地址并对外投资设立全资子公司的公告 | 2025-08-13 | Chinese | ||
| 37288218 | 2025年第三次临时股东大会决议公告 | 2025-08-01 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.