Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公司章程（2025年7月） | 2025-07-16 | Chinese | |
| 特定对象来访接待管理制度（2025年7月） | 2025-07-16 | Chinese | |
| 信息披露暂缓与豁免管理制度（2025年7月） | 2025-07-16 | Chinese | |
| 关于召开2025年第三次临时股东大会的通知 | 2025-07-16 | Chinese | |
| 外部信息使用人管理制度（2025年7月） | 2025-07-16 | Chinese | |
| 会计师事务所选聘制度（2025年7月） | 2025-07-16 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37288045 | 公司章程（2025年7月） | 2025-07-16 | Chinese | ||
| 37288026 | 特定对象来访接待管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37288019 | 信息披露暂缓与豁免管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37288008 | 关于召开2025年第三次临时股东大会的通知 | 2025-07-16 | Chinese | ||
| 37288006 | 外部信息使用人管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287994 | 会计师事务所选聘制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287988 | 总经理工作细则（2025年7月） | 2025-07-16 | Chinese | ||
| 37287978 | 独立董事工作制度(2025年7月） | 2025-07-16 | Chinese | ||
| 37287970 | 董事会议事规则（2025年7月） | 2025-07-16 | Chinese | ||
| 37287963 | 独立董事专门会议工作细则（2025年7月） | 2025-07-16 | Chinese | ||
| 37287954 | 关联交易管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287946 | 信息披露管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287942 | 股东会议事规则（2025年7月） | 2025-07-16 | Chinese | ||
| 37287935 | 董事、高级管理人员持有公司股份及其变动管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287928 | 对外投资管理制度（2025年7月） | 2025-07-16 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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