Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 对外提供财务资助管理制度（2025年7月） | 2025-07-16 | Chinese | |
| 内幕信息知情人登记管理制度（2025年7月） | 2025-07-16 | Chinese | |
| 战略与ESG委员会工作细则（2025年7月） | 2025-07-16 | Chinese | |
| 对外担保管理制度（2025年7月） | 2025-07-16 | Chinese | |
| 年报信息披露重大差错责任追究制度（2025年7月） | 2025-07-16 | Chinese | |
| 内部信息保密制度（2025年7月) | 2025-07-16 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37287921 | 对外提供财务资助管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287915 | 内幕信息知情人登记管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287901 | 战略与ESG委员会工作细则（2025年7月） | 2025-07-16 | Chinese | ||
| 37287895 | 对外担保管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287890 | 年报信息披露重大差错责任追究制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287884 | 内部信息保密制度（2025年7月) | 2025-07-16 | Chinese | ||
| 37287879 | 重大信息内部报告制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287868 | 外汇衍生品交易业务管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287863 | 董事、高级管理人员离职管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287857 | 董事会秘书工作制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287849 | 提名委员会工作细则（2025年7月） | 2025-07-16 | Chinese | ||
| 37287840 | 募集资金管理制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287821 | 内部审计制度（2025年7月） | 2025-07-16 | Chinese | ||
| 37287811 | 2025年第二次临时股东大会的法律意见书 | 2025-07-16 | Chinese | ||
| 37287796 | 2025年第二次临时股东大会决议公告 | 2025-07-16 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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