Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于召开2025年第二次临时股东大会的提示性公告 | 2025-07-14 | Chinese | |
| 关于为子公司申请银行授信提供担保的公告 | 2025-06-30 | Chinese | |
| 第五届董事会第十七次会议决议公告 | 2025-06-30 | Chinese | |
| 关于召开2025年第二次临时股东大会的通知 | 2025-06-30 | Chinese | |
| 第五届监事会第十五次会议决议公告 | 2025-06-30 | Chinese | |
| 关于控股股东为公司及子公司申请银行授信提供关联担保的公告 | 2025-06-30 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37287783 | 关于召开2025年第二次临时股东大会的提示性公告 | 2025-07-14 | Chinese | ||
| 37287775 | 关于为子公司申请银行授信提供担保的公告 | 2025-06-30 | Chinese | ||
| 37287766 | 第五届董事会第十七次会议决议公告 | 2025-06-30 | Chinese | ||
| 37287759 | 关于召开2025年第二次临时股东大会的通知 | 2025-06-30 | Chinese | ||
| 37287758 | 第五届监事会第十五次会议决议公告 | 2025-06-30 | Chinese | ||
| 37287738 | 关于控股股东为公司及子公司申请银行授信提供关联担保的公告 | 2025-06-30 | Chinese | ||
| 37287728 | 关于公司及子公司向银行申请综合授信额度的公告 | 2025-06-30 | Chinese | ||
| 37287722 | 关于全资子公司收购控股子公司部分股权暨关联交易的公告 | 2025-06-30 | Chinese | ||
| 37287706 | 关于监事会主席辞职的公告 | 2025-06-30 | Chinese | ||
| 37287696 | 2025年第一次临时股东大会的法律意见书 | 2025-06-30 | Chinese | ||
| 37287684 | 2025年第一次临时股东大会决议公告 | 2025-06-30 | Chinese | ||
| 37287674 | 关于控股股东部分股票质押展期的公告 | 2025-06-30 | Chinese | ||
| 37287669 | 关于本次交易相关内幕信息知情人买卖股票情况的自查报告的公告 | 2025-06-26 | Chinese | ||
| 37287661 | 华泰联合证券有限责任公司关于公司本次交易相关内幕信息知情人买卖股票情况的自查报告的核查意见 | 2025-06-26 | Chinese | ||
| 37287652 | 北京市金杜律师事务所上海分所关于公司本次重大资产出售之内幕信息知情人股票交易自查情况的专项核查意见 | 2025-06-26 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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