
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于控股子公司MEMS硅晶振通过验证并启动试产的公告 | 2025-08-01 | Chinese | |
| 2025年第三次临时股东大会的法律意见书 | 2025-08-01 | Chinese | |
| 关于持股5%以上股东减持股份触及1%整数倍的公告 | 2025-07-29 | Chinese | |
| 关于召开2025年第三次临时股东大会的提示性公告 | 2025-07-29 | Chinese | |
| 北京市金杜律师事务所上海分所关于公司重大资产出售之实施情况的法律意见书 | 2025-07-25 | Chinese | |
| 重大资产出售实施情况报告书 | 2025-07-25 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37288213 | 关于控股子公司MEMS硅晶振通过验证并启动试产的公告 | 2025-08-01 | Chinese | ||
| 37288204 | 2025年第三次临时股东大会的法律意见书 | 2025-08-01 | Chinese | ||
| 37288191 | 关于持股5%以上股东减持股份触及1%整数倍的公告 | 2025-07-29 | Chinese | ||
| 37288190 | 关于召开2025年第三次临时股东大会的提示性公告 | 2025-07-29 | Chinese | ||
| 37288173 | 北京市金杜律师事务所上海分所关于公司重大资产出售之实施情况的法律意见书 | 2025-07-25 | Chinese | ||
| 37288157 | 重大资产出售实施情况报告书 | 2025-07-25 | Chinese | ||
| 37288148 | 华泰联合证券有限责任公司关于公司重大资产出售实施情况之独立财务顾问核查意见 | 2025-07-25 | Chinese | ||
| 37288134 | 关于重大资产出售交割完成的公告 | 2025-07-25 | Chinese | ||
| 37288124 | 关于重大资产出售的进展公告 | 2025-07-24 | Chinese | ||
| 37288113 | 第五届董事会第十八次会议决议公告 | 2025-07-16 | Chinese | ||
| 37288104 | 薪酬与考核委员会工作细则(2025年7月) | 2025-07-16 | Chinese | ||
| 37288093 | 董事、高级管理人员薪酬管理制度(2025年7月) | 2025-07-16 | Chinese | ||
| 37288084 | 关于修订《公司章程》的公告 | 2025-07-16 | Chinese | ||
| 37288064 | 审计委员会工作细则(2025年7月) | 2025-07-16 | Chinese | ||
| 37288057 | 投资者关系管理制度(2025年7月) | 2025-07-16 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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