NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于2023年限制性股票激励计划获得合肥市国资委批复的公告 | 2023-08-30 | Chinese | |
| 晶合集成关于相关股东延长锁定期的公告 | 2023-08-28 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司相关股东延长股份锁定期的核查意见 | 2023-08-28 | Chinese | |
| 晶合集成关于参加2023半年度半导体行业专场集体业绩说明会的公告 | 2023-08-25 | Chinese | |
| 晶合集成监事会关于公司2023年限制性股票激励计划首次授予激励对象名单的审核意见及公示情况说明 | 2023-08-25 | Chinese | |
| 晶合集成2023年第二次临时股东大会会议资料 | 2023-08-23 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39484496 | 晶合集成关于2023年限制性股票激励计划获得合肥市国资委批复的公告 | 2023-08-30 | Chinese | ||
| 39484487 | 晶合集成关于相关股东延长锁定期的公告 | 2023-08-28 | Chinese | ||
| 39484477 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司相关股东延长股份锁定期的核查意见 | 2023-08-28 | Chinese | ||
| 39484468 | 晶合集成关于参加2023半年度半导体行业专场集体业绩说明会的公告 | 2023-08-25 | Chinese | ||
| 39484463 | 晶合集成监事会关于公司2023年限制性股票激励计划首次授予激励对象名单的审核意见及公示情况说明 | 2023-08-25 | Chinese | ||
| 39484455 | 晶合集成2023年第二次临时股东大会会议资料 | 2023-08-23 | Chinese | ||
| 39484439 | 晶合集成第一届监事会第七次会议决议公告 | 2023-08-15 | Chinese | ||
| 39484427 | 2023年半年度报告摘要 | 2023-08-15 | Chinese | ||
| 39484409 | 晶合集成关于聘任高级管理人员的公告 | 2023-08-15 | Chinese | ||
| 39484393 | 晶合集成监事会关于公司2023年限制性股票激励计划(草案)的核查意见 | 2023-08-15 | Chinese | ||
| 39484381 | 晶合集成2023年限制性股票激励计划(草案) | 2023-08-15 | Chinese | ||
| 39484357 | 晶合集成2023年限制性股票激励计划(草案)摘要公告 | 2023-08-15 | Chinese | ||
| 39484320 | 晶合集成2023年限制性股票激励计划实施考核管理办法 | 2023-08-15 | Chinese | ||
| 39484309 | 2023年半年度报告 | 2023-08-15 | Chinese | ||
| 39484263 | 晶合集成2023年半年度募集资金存放与实际使用情况的专项报告 | 2023-08-15 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
Acbel
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
|
ACTIONS TECHNOLOGY CO., LTD.
Designs low-power wireless and multimedia SoCs for audio an…
|
688049 | CN | Manufacturing |
NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.