NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于使用部分超募资金永久补充流动资金的公告 | 2023-06-25 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用基本存款账户、银行电汇及信用证等方式支付募投项目所需资金并以募集资金等额置换的核查意见 | 2023-06-25 | Chinese | |
| 合肥晶合集成电路股份有限公司股东大会议事规则 | 2023-06-25 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用部分超募资金永久补充流动资金的核查意见 | 2023-06-25 | Chinese | |
| 合肥晶合集成电路股份有限公司章程 | 2023-06-25 | Chinese | |
| 合肥晶合集成电路股份有限公司对外投资管理制度 | 2023-06-25 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39483233 | 晶合集成关于使用部分超募资金永久补充流动资金的公告 | 2023-06-25 | Chinese | ||
| 39483230 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用基本存款账户、银行电汇及信用证等方式支付募投项目所需资金并以募集资金等额置换的核查意见 | 2023-06-25 | Chinese | ||
| 39483220 | 合肥晶合集成电路股份有限公司股东大会议事规则 | 2023-06-25 | Chinese | ||
| 39483214 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用部分超募资金永久补充流动资金的核查意见 | 2023-06-25 | Chinese | ||
| 39483205 | 合肥晶合集成电路股份有限公司章程 | 2023-06-25 | Chinese | ||
| 39483186 | 合肥晶合集成电路股份有限公司对外投资管理制度 | 2023-06-25 | Chinese | ||
| 39483182 | 晶合集成关于变更公司注册资本、公司类型、修订《公司章程》并办理工商变更登记及修订部分治理制度的公告 | 2023-06-25 | Chinese | ||
| 39483167 | 晶合集成关于使用募集资金置换预先投入募投项目及已支付发行费用的自筹资金的公告 | 2023-06-25 | Chinese | ||
| 39483160 | 晶合集成关于聘任高级管理人员的公告 | 2023-06-25 | Chinese | ||
| 39483146 | 合肥晶合集成电路股份有限公司独立董事工作制度 | 2023-06-25 | Chinese | ||
| 39483133 | 晶合集成关于增加闲置自有资金进行现金管理额度的公告 | 2023-06-25 | Chinese | ||
| 39483120 | 合肥晶合集成电路股份有限公司信息披露管理制度 | 2023-06-25 | Chinese | ||
| 39483113 | 晶合集成独立董事关于第一届董事会第十七次会议相关事项的独立意见 | 2023-06-25 | Chinese | ||
| 39483101 | 晶合集成关于使用部分闲置募集资金进行现金管理的公告 | 2023-06-25 | Chinese | ||
| 39483091 | 合肥晶合集成电路股份有限公司关联交易实施细则 | 2023-06-25 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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