NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成第一届董事会第十九次会议决议公告 | 2023-08-15 | Chinese | |
| 晶合集成2023年第二次临时股东大会通知 | 2023-08-15 | Chinese | |
| 晶合集成独立董事关于第一届董事会第十九次会议相关事项的独立意见 | 2023-08-15 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年半年度持续督导跟踪报告 | 2023-08-15 | Chinese | |
| 2022年年度社会责任报告 | 2023-08-15 | Chinese | |
| 晶合集成关于独立董事公开征集委托投票权的公告 | 2023-08-15 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39484244 | 晶合集成第一届董事会第十九次会议决议公告 | 2023-08-15 | Chinese | ||
| 39484228 | 晶合集成2023年第二次临时股东大会通知 | 2023-08-15 | Chinese | ||
| 39484203 | 晶合集成独立董事关于第一届董事会第十九次会议相关事项的独立意见 | 2023-08-15 | Chinese | ||
| 39484185 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年半年度持续督导跟踪报告 | 2023-08-15 | Chinese | ||
| 39484172 | 2022年年度社会责任报告 | 2023-08-15 | Chinese | ||
| 39483855 | 晶合集成关于独立董事公开征集委托投票权的公告 | 2023-08-15 | Chinese | ||
| 39483848 | 北京市金杜律师事务所上海分所关于合肥晶合集成电路股份有限公司2023年限制性股票激励计划(草案)的法律意见书 | 2023-08-15 | Chinese | ||
| 39483834 | 晶合集成2023年限制性股票激励计划首次授予激励对象名单 | 2023-08-15 | Chinese | ||
| 39483826 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司收购控股子公司少数股东股权的核查意见 | 2023-08-09 | Chinese | ||
| 39483815 | 合肥晶合集成电路股份有限公司拟股权收购所涉及的合肥新晶集成电路有限公司股东全部权益价值资产评估报告 | 2023-08-08 | Chinese | ||
| 39483438 | 晶合集成关于收购控股子公司少数股东股权方案的公告 | 2023-08-08 | Chinese | ||
| 39483426 | 晶合集成独立董事关于第一届董事会第十八次会议相关事项的独立意见 | 2023-08-08 | Chinese | ||
| 39483414 | 合肥新晶集成电路有限公司审计报告 | 2023-08-08 | Chinese | ||
| 39483248 | 晶合集成第一届监事会第六次会议决议公告 | 2023-08-08 | Chinese | ||
| 39483240 | 合肥晶合集成电路股份有限公司信息披露暂缓与豁免业务管理制度 | 2023-06-25 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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