NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成独立董事关于第一届董事会第二十二次会议相关事项的独立意见 | 2023-10-26 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司首次公开发行网下配售限售股上市流通的核查意见 | 2023-10-26 | Chinese | |
| 晶合集成关于聘任高级管理人员的公告 | 2023-10-26 | Chinese | |
| 晶合集成首次公开发行网下配售限售股上市流通公告 | 2023-10-26 | Chinese | |
| 晶合集成第一届董事会第二十一次会议决议公告 | 2023-10-24 | Chinese | |
| 晶合集成监事会关于公司2023年限制性股票激励计划首次授予激励对象名单(截至授予日)的核查意见 | 2023-10-24 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39484708 | 晶合集成独立董事关于第一届董事会第二十二次会议相关事项的独立意见 | 2023-10-26 | Chinese | ||
| 39484701 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司首次公开发行网下配售限售股上市流通的核查意见 | 2023-10-26 | Chinese | ||
| 39484682 | 晶合集成关于聘任高级管理人员的公告 | 2023-10-26 | Chinese | ||
| 39484673 | 晶合集成首次公开发行网下配售限售股上市流通公告 | 2023-10-26 | Chinese | ||
| 39484665 | 晶合集成第一届董事会第二十一次会议决议公告 | 2023-10-24 | Chinese | ||
| 39484653 | 晶合集成监事会关于公司2023年限制性股票激励计划首次授予激励对象名单(截至授予日)的核查意见 | 2023-10-24 | Chinese | ||
| 39484642 | 北京市金杜律师事务所上海分所关于合肥晶合集成电路股份有限公司2023年限制性股票激励计划调整及首次授予事项的法律意见书 | 2023-10-24 | Chinese | ||
| 39484621 | 晶合集成第一届监事会第八次会议决议公告 | 2023-10-24 | Chinese | ||
| 39484562 | 晶合集成关于向2023年限制性股票激励计划激励对象首次授予限制性股票的公告 | 2023-10-24 | Chinese | ||
| 39484549 | 晶合集成关于调整2023年限制性股票激励计划相关事项的公告 | 2023-10-24 | Chinese | ||
| 39484545 | 晶合集成独立董事关于第一届董事会第二十一次会议相关事项的独立意见 | 2023-10-24 | Chinese | ||
| 39484535 | 晶合集成2023年限制性股票激励计划首次授予激励对象名单(截至授予日) | 2023-10-24 | Chinese | ||
| 39484529 | 晶合集成2023年第二次临时股东大会决议公告 | 2023-08-31 | Chinese | ||
| 39484519 | 北京市金杜律师事务所上海分所关于合肥晶合集成电路股份有限公司2023年第二次临时股东大会的法律意见书 | 2023-08-31 | Chinese | ||
| 39484509 | 晶合集成关于2023年限制性股票激励计划内幕信息知情人买卖公司股票情况的自查报告 | 2023-08-31 | Chinese | ||
Market data
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Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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