NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成2023年年度业绩预告 | 2024-01-29 | Chinese | |
| 晶合集成关于以集中竞价交易方式回购股份方案的公告(更正后) | 2023-12-28 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用部分超募资金回购股份的核查意见 | 2023-12-28 | Chinese | |
| 晶合集成关于以集中竞价交易方式回购股份方案的更正公告 | 2023-12-28 | Chinese | |
| 晶合集成关于回购股份事项前十名股东和前十名无限售条件股东持股信息的公告 | 2023-12-27 | Chinese | |
| 晶合集成第一届监事会第十次会议决议公告 | 2023-12-24 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
1 filing
| |||||
| 39484908 | 晶合集成2023年年度业绩预告 | 2024-01-29 | Chinese | ||
|
2023
14 filings
| |||||
| 39484896 | 晶合集成关于以集中竞价交易方式回购股份方案的公告(更正后) | 2023-12-28 | Chinese | ||
| 39484880 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用部分超募资金回购股份的核查意见 | 2023-12-28 | Chinese | ||
| 39484866 | 晶合集成关于以集中竞价交易方式回购股份方案的更正公告 | 2023-12-28 | Chinese | ||
| 39484853 | 晶合集成关于回购股份事项前十名股东和前十名无限售条件股东持股信息的公告 | 2023-12-27 | Chinese | ||
| 39484842 | 晶合集成第一届监事会第十次会议决议公告 | 2023-12-24 | Chinese | ||
| 39484833 | 晶合集成独立董事关于第一届董事会第二十三次会议相关事项的独立意见 | 2023-12-24 | Chinese | ||
| 39484824 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司使用部分超募资金回购股份的核查意见 | 2023-12-24 | Chinese | ||
| 39484815 | 晶合集成关于以集中竞价交易方式回购股份方案的公告 | 2023-12-24 | Chinese | ||
| 39484805 | 晶合集成关于部分募投项目结项并将节余募集资金永久补充流动资金的公告 | 2023-12-24 | Chinese | ||
| 39484798 | 晶合集成第一届董事会第二十三次会议决议公告 | 2023-12-24 | Chinese | ||
| 39484792 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司部分募投项目结项并将节余募集资金永久补充流动资金的核查意见 | 2023-12-24 | Chinese | ||
| 39484781 | 晶合集成关于董事会、监事会延期换届的提示性公告 | 2023-11-16 | Chinese | ||
| 39484769 | 晶合集成关于召开2023年第三季度业绩说明会的公告 | 2023-11-08 | Chinese | ||
| 39484721 | 晶合集成2023年第三季度报告 | 2023-10-26 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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