NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于完成董事会、监事会换届选举及聘任高级管理人员、证券事务代表的公告 | 2024-03-15 | Chinese | |
| 晶合集成关于高级管理人员薪酬的公告 | 2024-03-15 | Chinese | |
| 北京市金杜律师事务所上海分所关于合肥晶合集成电路股份有限公司2024年第一次临时股东大会的法律意见书 | 2024-03-15 | Chinese | |
| 晶合集成关于回购股份事项前十名股东和前十名无限售条件股东持股信息的公告 | 2024-03-12 | Chinese | |
| 晶合集成2024年第一次临时股东大会会议资料 | 2024-03-06 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司拟购买土地使用权及在建工程项目暨关联交易的核查意见 | 2024-02-29 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39485807 | 晶合集成关于完成董事会、监事会换届选举及聘任高级管理人员、证券事务代表的公告 | 2024-03-15 | Chinese | ||
| 39485801 | 晶合集成关于高级管理人员薪酬的公告 | 2024-03-15 | Chinese | ||
| 39485791 | 北京市金杜律师事务所上海分所关于合肥晶合集成电路股份有限公司2024年第一次临时股东大会的法律意见书 | 2024-03-15 | Chinese | ||
| 39485756 | 晶合集成关于回购股份事项前十名股东和前十名无限售条件股东持股信息的公告 | 2024-03-12 | Chinese | ||
| 39485745 | 晶合集成2024年第一次临时股东大会会议资料 | 2024-03-06 | Chinese | ||
| 39485722 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司拟购买土地使用权及在建工程项目暨关联交易的核查意见 | 2024-02-29 | Chinese | ||
| 39485701 | 晶合集成关于选举职工代表监事的公告 | 2024-02-29 | Chinese | ||
| 39485685 | 合肥晶合集成电路股份有限公司独立董事工作制度 | 2024-02-28 | Chinese | ||
| 39485671 | 合肥晶合集成电路股份有限公司监事会议事规则 | 2024-02-28 | Chinese | ||
| 39485661 | 晶合集成关于召开2024年第一次临时股东大会的通知 | 2024-02-28 | Chinese | ||
| 39485653 | 晶合集成第一届监事会第十二次会议决议公告 | 2024-02-28 | Chinese | ||
| 39485644 | 晶合集成关于拟购买土地使用权及在建工程项目暨关联交易的公告 | 2024-02-28 | Chinese | ||
| 39485636 | 晶合集成独立董事关于第一届董事会第二十五次会议相关事项的事前认可意见 | 2024-02-28 | Chinese | ||
| 39485621 | 晶合集成独立董事候选人声明与承诺(陈绍亨) | 2024-02-28 | Chinese | ||
| 39485573 | 晶合集成独立董事提名人声明与承诺(安广实) | 2024-02-28 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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