NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成第二届董事会独立董事专门会议第一次会议决议 | 2024-04-14 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年年度持续督导跟踪报告 | 2024-04-14 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司部分募集资金投资项目延期的核查意见 | 2024-04-14 | Chinese | |
| 晶合集成第二届监事会第二次会议决议公告 | 2024-04-14 | Chinese | |
| 晶合集成2023年度募集资金存放与实际使用情况的专项报告 | 2024-04-14 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司预计2024年度日常关联交易的核查意见 | 2024-04-14 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39486099 | 晶合集成第二届董事会独立董事专门会议第一次会议决议 | 2024-04-14 | Chinese | ||
| 39486088 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年年度持续督导跟踪报告 | 2024-04-14 | Chinese | ||
| 39486067 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司部分募集资金投资项目延期的核查意见 | 2024-04-14 | Chinese | ||
| 39486053 | 晶合集成第二届监事会第二次会议决议公告 | 2024-04-14 | Chinese | ||
| 39486037 | 晶合集成2023年度募集资金存放与实际使用情况的专项报告 | 2024-04-14 | Chinese | ||
| 39486019 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司预计2024年度日常关联交易的核查意见 | 2024-04-14 | Chinese | ||
| 39485994 | 晶合集成2023年年度报告 | 2024-04-14 | Chinese | ||
| 39485888 | 晶合集成关于2023年度利润分配方案的公告 | 2024-04-14 | Chinese | ||
| 39485880 | 晶合集成2023年度独立董事述职报告(张北超) | 2024-04-14 | Chinese | ||
| 39485871 | 晶合集成关于以集中竞价交易方式首次回购公司股份的公告 | 2024-04-08 | Chinese | ||
| 39485863 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年度持续督导工作现场检查报告 | 2024-04-03 | Chinese | ||
| 39485846 | 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-04-02 | Chinese | ||
| 39485836 | 晶合集成关于以集中竞价交易方式回购公司股份的回购报告书 | 2024-03-29 | Chinese | ||
| 39485834 | 晶合集成第二届监事会第一次会议决议公告 | 2024-03-15 | Chinese | ||
| 39485824 | 晶合集成2024年第一次临时股东大会决议公告 | 2024-03-15 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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