NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于使用闲置自有资金进行现金管理的公告 | 2024-05-31 | Chinese | |
| 晶合集成关于续聘会计师事务所的公告 | 2024-05-31 | Chinese | |
| 晶合集成2023年限制性股票激励计划预留授予激励对象名单(截至预留授予日) | 2024-05-31 | Chinese | |
| 晶合集成关于以集中竞价交易方式回购公司股份达到2%暨回购进展公告 | 2024-05-23 | Chinese | |
| 晶合集成关于参加2023年度半导体材料集体业绩说明会暨2024年第一季度业绩说明会的公告 | 2024-05-09 | Chinese | |
| 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-05-06 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39487416 | 晶合集成关于使用闲置自有资金进行现金管理的公告 | 2024-05-31 | Chinese | ||
| 39487407 | 晶合集成关于续聘会计师事务所的公告 | 2024-05-31 | Chinese | ||
| 39487396 | 晶合集成2023年限制性股票激励计划预留授予激励对象名单(截至预留授予日) | 2024-05-31 | Chinese | ||
| 39487387 | 晶合集成关于以集中竞价交易方式回购公司股份达到2%暨回购进展公告 | 2024-05-23 | Chinese | ||
| 39487379 | 晶合集成关于参加2023年度半导体材料集体业绩说明会暨2024年第一季度业绩说明会的公告 | 2024-05-09 | Chinese | ||
| 39487369 | 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-05-06 | Chinese | ||
| 39487356 | 晶合集成第二届监事会第三次会议决议公告 | 2024-04-29 | Chinese | ||
| 39487350 | 晶合集成2024年第一季度报告 | 2024-04-29 | Chinese | ||
| 39487344 | 晶合集成关于2024年第一季度计提资产减值准备的公告 | 2024-04-29 | Chinese | ||
| 39487306 | 晶合集成关于以集中竞价交易方式回购公司股份达到1%暨回购进展公告 | 2024-04-24 | Chinese | ||
| 39487297 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司首次公开发行部分限售股及战略配售限售股股票上市流通的核查意见 | 2024-04-22 | Chinese | ||
| 39487284 | 晶合集成首次公开发行部分限售股及战略配售限售股股票上市流通公告 | 2024-04-22 | Chinese | ||
| 39487215 | 合肥晶合集成电路股份有限公司2023年度募集资金存放与实际使用情况鉴证报告 | 2024-04-14 | Chinese | ||
| 39487141 | 晶合集成董事会关于独立董事独立性情况的专项意见 | 2024-04-14 | Chinese | ||
| 39487130 | 晶合集成2023年度独立董事述职报告(陈绍亨) | 2024-04-14 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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