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NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings

Ticker · 688249 ISIN · CNE1000060L1 Shanghai Stock Exchange Manufacturing
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Filings indexed 452 across all filing types
Latest filing 2024-09-20 Board/Management Inform…
Country CN China
Listing Shanghai Stock Exchange 688249

About NEXCHIP SEMICONDUCTOR CORPORATION

https://www.nexchip.com.cn

Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.

Recent filings

Filing Released Lang Actions
晶合集成第二届监事会第六次会议决议公告
Board/Management Information Classification · 95% confidence The document is a resolution announcement from the Supervisory Board (监事会) of Hefei Jinghe Integrated Circuit Co., Ltd. It details the meeting date, attendance, legal compliance, and the approval of an external investment and related party transaction proposal. It references a related announcement (2024-054) for more details. The document is a formal meeting resolution announcement rather than a full report or financial statement. It does not contain financial data, earnings, or audit information. It is not a report publication announcement since it contains substantive meeting resolution content. The document fits best under Board/Management Information (MANG) as it relates to supervisory board decisions and governance matters.
2024-09-20 Chinese
晶合集成关于拟对外投资暨关联交易的公告
Capital/Financing Update Classification · 95% confidence The document is a detailed announcement from Hefei Jinghe Integrated Circuit Co., Ltd. regarding a proposed external investment and related party transaction. It includes comprehensive information about the transaction, the parties involved, the investment amount, the nature of the transaction as an associated party transaction, approvals by the board and supervisory committee, and the sponsor's verification opinion. The document is lengthy (over 11,000 characters) and contains detailed disclosures about the investment, the related parties, the transaction pricing, and the impact on the company. It is not a financial report like an annual or interim report, nor is it a call transcript or earnings release. It is not a simple announcement of a report publication but a substantive disclosure about a capital investment and related party transaction. This fits the definition of a Capital/Financing Update (CAP), which covers updates on company fundraising, financing activities, or capital structure changes. Therefore, the appropriate classification is CAP with high confidence.
2024-09-20 Chinese
晶合集成关于以集中竞价交易方式回购公司股份达到3%暨回购进展公告
Transaction in Own Shares Classification · 100% confidence The document is an announcement from Hefei Jinghe Integrated Circuit Co., Ltd. regarding the progress of its share repurchase program. It details the number of shares repurchased, the percentage of total shares repurchased (3.03%), the price range, and the total amount spent. It references regulatory compliance with stock exchange rules and provides updates on the repurchase progress. The document is not a full financial report but a specific update on share buyback activity. Therefore, it fits the category of 'Transaction in Own Shares' (POS). The document length is short and focused solely on share repurchase progress, confirming it is not a full report or announcement of a report publication.
2024-09-06 Chinese
晶合集成关于参加2024年半年度集体业绩说明会的公告
Investor Presentation Classification · 95% confidence The document is an announcement from Hefei Nexchip Integrated Circuit Co., Ltd. about participating in the 2024 semi-annual collective performance briefing organized by the Shanghai Stock Exchange. It specifies the date, time, format (online text interaction), and participation details for the event. The document references the company's 2024 semi-annual report already disclosed on August 14, 2024, but this document itself is not the report; it is an announcement about the upcoming investor presentation related to the semi-annual results. The document length is short (1270 characters), and it does not contain actual financial data or detailed financial analysis. Therefore, it is not an Interim/Quarterly Report (IR) or Annual Report (10-K). It is also not a Call Transcript (CT) since it is a notice of a future event, not a transcript. The document fits best as an Investor Presentation (IP) announcement or a Regulatory Filing (RNS). However, since it is announcing participation in a collective performance briefing (an investor presentation event) and provides details about the event, the best classification is Investor Presentation (IP).
2024-09-02 Chinese
晶合集成关于以集中竞价交易方式回购公司股份的进展公告
Transaction in Own Shares Classification · 100% confidence The document is an announcement regarding the progress of the company's share repurchase program. It details the number of shares repurchased, the price range, total amount spent, and compliance with relevant regulations. It does not contain financial statements or detailed financial analysis but focuses on the share buyback activity. This fits the definition of a Transaction in Own Shares (POS) filing, which reports on the company's buyback or sale of its own shares.
2024-09-02 Chinese
晶合集成关于新产品研发进展的自愿性披露公告
Regulatory Filings Classification · 95% confidence The document is a voluntary disclosure announcement by Hefei Jinghe Integrated Circuit Co., Ltd. about the progress of a new product development, specifically the successful trial production of a 180 million pixel full-frame CMOS image sensor. It includes details about the product, its impact on the company, and risk warnings. The document is short (972 characters) and does not contain financial statements or detailed financial analysis. It is an announcement of new product R&D progress rather than a financial report or regulatory filing. Therefore, it fits best under Regulatory Filings (RNS) as a general announcement that does not fit other specific categories.
2024-08-20 Chinese

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