NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成关于向全资子公司增资并引入外部投资者的进展公告 | 2024-12-31 | Chinese | |
| 合肥晶合集成电路股份有限公司股东会议事规则 | 2024-12-31 | Chinese | |
| 晶合集成第二届监事会第九次会议决议公告 | 2024-12-31 | Chinese | |
| 晶合集成关于部分募投项目延期的公告 | 2024-12-31 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司终止部分募投项目并变更募集资金至其他募投项目的核查意见 | 2024-12-31 | Chinese | |
| 合肥晶合集成电路股份有限公司章程 | 2024-12-31 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39488785 | 晶合集成关于向全资子公司增资并引入外部投资者的进展公告 | 2024-12-31 | Chinese | ||
| 39488771 | 合肥晶合集成电路股份有限公司股东会议事规则 | 2024-12-31 | Chinese | ||
| 39488747 | 晶合集成第二届监事会第九次会议决议公告 | 2024-12-31 | Chinese | ||
| 39488741 | 晶合集成关于部分募投项目延期的公告 | 2024-12-31 | Chinese | ||
| 39488727 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司终止部分募投项目并变更募集资金至其他募投项目的核查意见 | 2024-12-31 | Chinese | ||
| 39488720 | 合肥晶合集成电路股份有限公司章程 | 2024-12-31 | Chinese | ||
| 39488711 | 合肥晶合集成电路股份有限公司关联交易实施细则 | 2024-12-31 | Chinese | ||
| 39488702 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司部分募投项目延期的核查意见 | 2024-12-31 | Chinese | ||
| 39488694 | 晶合集成股东询价转让结果报告书暨持股5%以上股东权益变动超过1%的提示性公告 | 2024-12-19 | Chinese | ||
| 39488686 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司股东向特定机构投资者询价转让股份的核查报告 | 2024-12-19 | Chinese | ||
| 39488674 | 晶合集成股东询价转让定价情况提示性公告 | 2024-12-16 | Chinese | ||
| 39488657 | 晶合集成股东询价转让计划书 | 2024-12-13 | Chinese | ||
| 39488647 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司股东向特定机构投资者询价转让股份相关资格的核查意见 | 2024-12-13 | Chinese | ||
| 39488637 | 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-12-02 | Chinese | ||
| 39488630 | 晶合集成关于受让大额存单产品暨关联交易的公告 | 2024-11-14 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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