NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶合集成第二届董事会独立董事专门会议第三次会议决议 | 2024-11-14 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司受让大额存单产品暨关联交易的核查意见 | 2024-11-14 | Chinese | |
| 晶合集成第二届监事会第八次会议决议公告 | 2024-11-14 | Chinese | |
| 晶合集成关于变更项目合伙人及签字注册会计师的公告 | 2024-11-05 | Chinese | |
| 晶合集成关于召开2024年第三季度业绩说明会的公告 | 2024-11-05 | Chinese | |
| 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-11-04 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39488622 | 晶合集成第二届董事会独立董事专门会议第三次会议决议 | 2024-11-14 | Chinese | ||
| 39488614 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司受让大额存单产品暨关联交易的核查意见 | 2024-11-14 | Chinese | ||
| 39488595 | 晶合集成第二届监事会第八次会议决议公告 | 2024-11-14 | Chinese | ||
| 39488584 | 晶合集成关于变更项目合伙人及签字注册会计师的公告 | 2024-11-05 | Chinese | ||
| 39488575 | 晶合集成关于召开2024年第三季度业绩说明会的公告 | 2024-11-05 | Chinese | ||
| 39488564 | 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-11-04 | Chinese | ||
| 39488552 | 晶合集成2024年第三季度报告 | 2024-10-28 | Chinese | ||
| 39488541 | 晶合集成关于新产品研发进展的自愿性披露公告 | 2024-10-09 | Chinese | ||
| 39488533 | 晶合集成2024年前三季度业绩预告的自愿性披露公告 | 2024-10-09 | Chinese | ||
| 39488518 | 晶合集成关于以集中竞价交易方式回购公司股份的进展公告 | 2024-10-08 | Chinese | ||
| 39488507 | 晶合集成关于向全资子公司增资并引入外部投资者的公告 | 2024-09-25 | Chinese | ||
| 39488498 | 合肥皖芯集成电路有限公司拟引进投资者涉及的合肥皖芯集成电路有限公司股东全部权益价值资产评估报告 | 2024-09-25 | Chinese | ||
| 39488373 | 合肥皖芯集成电路有限公司审计报告 | 2024-09-25 | Chinese | ||
| 39487819 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司拟对外投资暨关联交易的核查意见 | 2024-09-20 | Chinese | ||
| 39487809 | 晶合集成第二届董事会独立董事专门会议第二次会议决议 | 2024-09-20 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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