NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings
Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 合肥晶合集成电路股份有限公司2023年度非经营性资金占用及其他关联资金往来情况专项说明 | 2024-04-14 | Chinese | |
| 合肥晶合集成电路股份有限公司会计师事务所选聘制度 | 2024-04-14 | Chinese | |
| 晶合集成2023年度内部控制评价报告 | 2024-04-14 | Chinese | |
| 晶合集成2023年度会计师事务所的履职情况评估报告 | 2024-04-14 | Chinese | |
| 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年度募集资金存放与实际使用情况的核查意见 | 2024-04-14 | Chinese | |
| 晶合集成2023年度审计委员会对会计师事务所履行监督职责情况报告 | 2024-04-14 | Chinese |
Browse filings by year
4 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39487119 | 合肥晶合集成电路股份有限公司2023年度非经营性资金占用及其他关联资金往来情况专项说明 | 2024-04-14 | Chinese | ||
| 39486958 | 合肥晶合集成电路股份有限公司会计师事务所选聘制度 | 2024-04-14 | Chinese | ||
| 39486949 | 晶合集成2023年度内部控制评价报告 | 2024-04-14 | Chinese | ||
| 39486936 | 晶合集成2023年度会计师事务所的履职情况评估报告 | 2024-04-14 | Chinese | ||
| 39486931 | 中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司2023年度募集资金存放与实际使用情况的核查意见 | 2024-04-14 | Chinese | ||
| 39486915 | 晶合集成2023年度审计委员会对会计师事务所履行监督职责情况报告 | 2024-04-14 | Chinese | ||
| 39486908 | 晶合集成2023年度可持续发展报告暨ESG报告 | 2024-04-14 | Chinese | ||
| 39486751 | 晶合集成2023年度董事会审计委员会履职报告 | 2024-04-14 | Chinese | ||
| 39486739 | 合肥晶合集成电路股份有限公司2023年度审计报告 | 2024-04-14 | Chinese | ||
| 39486227 | 晶合集成关于2023年度计提资产减值准备的公告 | 2024-04-14 | Chinese | ||
| 39486216 | 晶合集成2023年度独立董事述职报告(安广实) | 2024-04-14 | Chinese | ||
| 39486183 | 晶合集成关于预计2024年度日常关联交易的公告 | 2024-04-14 | Chinese | ||
| 39486163 | 晶合集成2023年年度报告摘要 | 2024-04-14 | Chinese | ||
| 39486126 | 晶合集成2024年度“提质增效重回报”行动方案 | 2024-04-14 | Chinese | ||
| 39486110 | 晶合集成关于部分募集资金投资项目延期的公告 | 2024-04-14 | Chinese | ||
Market data
Market data not available
Price history
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NEXCHIP SEMICONDUCTOR CORPORATION via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58272/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58272 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58272 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58272 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58272}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for NEXCHIP SEMICONDUCTOR CORPORATION (id: 58272)"
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