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TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings

Ticker · 002156 ISIN · CNE1000006C3 LEI · 655600LP4PHNNE8FAX71 Shenzhen Stock Exchange Manufacturing
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Filings indexed 1,954 across all filing types
Latest filing 2021-09-27 Audit Report / Informat…
Country CN China
Listing Shenzhen Stock Exchange 002156

About TongFu Microelectronics Co.,Ltd.

https://www.tfme.com

TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.

Recent filings

Filing Released Lang Actions
通富微电子股份有限公司前次募集资金使用情况的鉴证报告
Audit Report / Information Classification · 95% confidence The document is titled as a "前次募集资金使用情况鉴证报告" which translates to "Previous Fundraising Use Verification Report." It contains detailed information about the use of funds raised in previous non-public stock issuances in 2017 and 2020, including amounts raised, usage, investment projects, and effectiveness of those investments. The document includes audit opinions from an accounting firm (致同会计师事务所) verifying the use of the funds according to regulatory requirements from the China Securities Regulatory Commission (CSRC). It also contains detailed financial data on the investment projects, usage of funds, and related performance metrics. The document is not an announcement of a report but the report itself, with substantive financial and operational data. This type of document corresponds to an Audit Report / Information (AR) as it is a standalone audit verification report on the use of previously raised funds, including compliance with regulatory requirements and financial verification, but it is not a full Annual Report or Interim Report. Therefore, the correct classification is AR with high confidence. H1 2021
2021-09-27 Chinese
通富微电子股份有限公司关于最近五年被证券监管部门和交易所处罚或采取监管措施及整改情况的公告
Regulatory Filings Classification · 95% confidence The document is an announcement from Tongfu Microelectronics Co., Ltd. regarding regulatory penalties and supervisory measures taken by securities regulatory authorities and stock exchanges over the past five years. It details a specific regulatory letter received from the Shenzhen Stock Exchange and the company's corrective actions. The document is a formal disclosure about regulatory compliance and past penalties, not a financial report, earnings release, or management discussion. It does not contain financial statements or detailed financial data. It is a regulatory announcement about compliance and penalties, fitting best under Regulatory Filings (RNS). The document length is short (1414 characters), and it is not a report publication announcement or certification letter but a regulatory disclosure. Therefore, the appropriate classification is Regulatory Filings (RNS).
2021-09-27 Chinese
通富微电子股份有限公司2021年度非公开发行A股股票预案
Capital/Financing Update Classification · 95% confidence The document is a detailed plan and explanation for a non-public issuance of A shares by Tongfu Microelectronics Co., Ltd. It includes information about the issuance background, purpose, pricing, quantity, target investors, lock-up period, listing location, and use of proceeds. It is a comprehensive disclosure related to a capital raising event through a private placement of shares. The document is not a financial report, earnings release, or management discussion, but rather a detailed capital/financing update describing the issuance plan and related corporate actions. Therefore, the appropriate classification is Capital/Financing Update (CAP). The document length and detail confirm it is not a mere announcement or regulatory filing but a substantive financing plan.
2021-09-27 Chinese
通富微电子股份有限公司第七届董事会第七次会议决议公告
Capital/Financing Update Classification · 95% confidence The document is a detailed announcement of the resolutions passed at the seventh meeting of the seventh board of directors of Tongfu Microelectronics Co., Ltd. It focuses on the approval of a non-public issuance of A shares, including specifics on the issuance conditions, pricing, quantity, target investors, lock-up period, and use of proceeds. It also mentions the authorization of the board to handle related matters and references prior reports and audit opinions related to the use of previously raised funds. The content is about capital raising activities and financing plans rather than a full financial report or earnings release. It is not a simple announcement of a report publication but a substantive disclosure of financing decisions and plans. Therefore, the document fits best under the category of Capital/Financing Update (CAP).
2021-09-27 Chinese
2021年半年度报告摘要
Interim / Quarterly Report Classification · 95% confidence The document is titled as a '2021 年半年度报告摘要' which translates to '2021 Semi-Annual Report Summary'. It contains detailed financial data for the half-year period, including revenue, net profit, earnings per share, and asset information. It also includes shareholder information and notes on changes in controlling shareholders, which are typical components of an interim or quarterly report. The document length is 3237 characters, which is relatively short but contains substantive financial data and analysis, not just an announcement or a link to a report. Therefore, it fits the definition of an Interim / Quarterly Report (IR). H1 2021
2021-08-29 Chinese
招商证券股份有限公司关于通富微电子股份有限公司2021年半年度募集资金存放与使用情况的核查意见
Capital/Financing Update Classification · 95% confidence The document is a detailed report from a securities company (招商证券股份有限公司) regarding the half-year (2021) verification of the storage and use of funds raised by 通富微电子股份有限公司. It includes specific financial figures about the amount raised, usage, storage, and management of the funds, as well as compliance with regulatory requirements. The document references the 2021 half-year period and contains substantive financial data and analysis related to the use of raised capital. This matches the characteristics of a report on capital or financing activities, specifically focusing on the use and management of raised funds. Therefore, the document fits best under the category 'Capital/Financing Update' (CAP). The document length (6957 characters) and detailed content confirm it is a full report rather than a brief announcement or certification. Hence, the classification is CAP with high confidence.
2021-08-29 Chinese

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