
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2022年半年度报告摘要 | 2022-08-24 | Chinese | |
| 半年报董事会决议公告 | 2022-08-24 | Chinese | |
| 半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2022-08-24 | Chinese | |
| 关于增加2022年度日常关联交易计划的公告 | 2022-08-24 | Chinese | |
| 半年报监事会决议公告 | 2022-08-24 | Chinese | |
| 海通证券股份有限公司关于通富微电子股份有限公司增加2022年度日常关联交易计划的核查意见 | 2022-08-24 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 34959489 | 2022年半年度报告摘要 | 2022-08-24 | Chinese | ||
| 34959479 | 半年报董事会决议公告 | 2022-08-24 | Chinese | ||
| 34959467 | 半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2022-08-24 | Chinese | ||
| 34959459 | 关于增加2022年度日常关联交易计划的公告 | 2022-08-24 | Chinese | ||
| 34959448 | 半年报监事会决议公告 | 2022-08-24 | Chinese | ||
| 34959437 | 海通证券股份有限公司关于通富微电子股份有限公司增加2022年度日常关联交易计划的核查意见 | 2022-08-24 | Chinese | ||
| 34959429 | 独立董事关于公司第七届董事会第十六次会议相关事项的事前认可独立意见 | 2022-08-24 | Chinese | ||
| 34959422 | 独立董事关于控股股东及其他关联方占用公司资金、公司对外担保情况的专项说明和独立意见 | 2022-08-24 | Chinese | ||
| 34959413 | 股票交易异常波动公告 | 2022-08-08 | Chinese | ||
| 34959403 | 关于公司第七届董事会第十五次会议相关事项的独立意见 | 2022-07-26 | Chinese | ||
| 34959394 | 关于向参股子公司增资暨关联交易的公告 | 2022-07-26 | Chinese | ||
| 34959383 | 第七届董事会第十五次会议决议公告 | 2022-07-26 | Chinese | ||
| 34959371 | 关于公司第七届董事会第十五次会议相关事项的事前认可独立意见 | 2022-07-26 | Chinese | ||
| 34959363 | 海通证券股份有限公司关于通富微电子股份有限公司向参股子公司增资暨关联交易的核查意见 | 2022-07-26 | Chinese | ||
| 34959352 | 关于控股股东股份质押的公告 | 2022-06-30 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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