Skip to main content
Shennan Circuits Co., Ltd. logo

Shennan Circuits Co., Ltd. — Investor Relations & Filings

Ticker · 002916 ISIN · CNE100003373 LEI · 300300VRJEDEV10SPJ55 Shenzhen Stock Exchange Manufacturing
Filings indexed 1,200 across all filing types
Latest filing 2017-11-20 Regulatory Filings
Country CN China
Listing Shenzhen Stock Exchange 002916

About Shennan Circuits Co., Ltd.

https://www.scc.com.cn

Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.

Recent filings

Filing Released Lang Actions
2016年第四次临时股东大会决议
Regulatory Filings
2017-11-20 Chinese
首次公开发行股票招股意向书摘要
Capital/Financing Update Classification · 95% confidence The document is titled as a "首次公开发行股票招股意向书摘要" which translates to "Summary of Prospectus for Initial Public Offering (IPO)". It contains detailed information about the IPO, including commitments by shareholders, lock-up agreements, risk factors, use of proceeds, and legal commitments by the issuer and intermediaries. The document is lengthy (15,000 characters) and contains substantive content related to the IPO process and disclosures. This type of document is a prospectus or offering document related to capital raising and issuance of new shares. According to the filing definitions, updates on company fundraising, financing activities, or capital structure changes fall under Capital/Financing Update (CAP). This document is not an annual report, audit report, or earnings release, nor is it a simple announcement or regulatory filing. Therefore, the best fitting category is Capital/Financing Update (CAP).
2017-11-20 Chinese
中国证监会关于核准公司首次公开发行股票的批复
Regulatory Filings
2017-11-20 Chinese
公司章程(草案)
Regulatory Filings
2017-11-20 Chinese
北京市康达律师事务所关于公司首次公开发行股票并在深圳证券交易所中小企业板上市的补充法律意见书(四)
Audit Report / Information Classification · 95% confidence The document is titled '补充法律意见书(四)' which translates to 'Supplementary Legal Opinion (IV)'. It is issued by a law firm (北京市康达律师事务所) regarding the initial public offering and listing of 深南电路股份有限公司 on the Shenzhen Stock Exchange SME board. The content includes detailed legal opinions on tax policies, employee stock plans, acquisition feasibility, patent usage, shareholder meeting resolutions, environmental compliance, and other legal compliance matters related to the IPO process. It references multiple prior legal opinion letters and audit reports but is itself a legal opinion document. It does not contain financial statements or earnings data, nor is it a transcript, presentation, or announcement. It is a standalone legal audit/opinion report related to regulatory compliance and legal due diligence for the IPO. Therefore, it fits best under the category of Audit Report / Information (AR). H1 2017
2017-11-20 Chinese
首次公开发行股票招股意向书
Regulatory Filings
2017-11-20 Chinese

Report missing filing

Can't find a specific document? Let us know and we'll add it within 24 hours.

We will notify you once the filing is added.
Report sent
Thank you. We will check the data and update it shortly.