Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2025年年度报告摘要 | 2026-03-12 | Chinese | |
| 2025年度内部控制自我评价报告 | 2026-03-12 | Chinese | |
| 关于召开2025年年度股东会的通知 | 2026-03-12 | Chinese | |
| 董事会关于独立董事独立性自查情况的专项报告 | 2026-03-12 | Chinese | |
| 2025年度独立董事述职报告（黄亚英） | 2026-03-12 | Chinese | |
| 关于举办2025年度网上业绩说明会并征集相关问题的公告 | 2026-03-12 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 36790692 | 2025年年度报告摘要 | 2026-03-12 | Chinese | ||
| 36790689 | 2025年度内部控制自我评价报告 | 2026-03-12 | Chinese | ||
| 36790679 | 关于召开2025年年度股东会的通知 | 2026-03-12 | Chinese | ||
| 36790664 | 董事会关于独立董事独立性自查情况的专项报告 | 2026-03-12 | Chinese | ||
| 36790661 | 2025年度独立董事述职报告（黄亚英） | 2026-03-12 | Chinese | ||
| 36790651 | 关于举办2025年度网上业绩说明会并征集相关问题的公告 | 2026-03-12 | Chinese | ||
| 36790641 | 公司章程修订对照表 | 2026-03-12 | Chinese | ||
| 36790636 | 公司章程（2026年3月） | 2026-03-12 | Chinese | ||
| 36790635 | 关于增加外汇衍生品套期保值业务规模的公告 | 2026-03-12 | Chinese | ||
| 36790623 | 2025年度非经营性资金占用及其他关联资金往来情况汇总表 | 2026-03-12 | Chinese | ||
| 36790614 | 2025年年度审计报告 | 2026-03-12 | Chinese | ||
| 36790603 | 2025年度独立董事述职报告（于洪宇） | 2026-03-12 | Chinese | ||
| 36790595 | 2025年可持续发展（ESG）报告 | 2026-03-12 | Chinese | ||
| 36790556 | 2025年度募集资金存放、管理与使用情况的专项报告 | 2026-03-12 | Chinese | ||
| 36790541 | 募集资金年度存放、管理与使用情况鉴证报告 | 2026-03-12 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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