
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公开发行可转换公司债券预案 | 2019-04-08 | Chinese | |
| 可转换公司债券持有人会议规则(2019年4月) | 2019-04-08 | Chinese | |
| 2018年年度股东大会的法律意见书 | 2019-04-07 | Chinese | |
| 2018年年度股东大会决议(已取消) | 2019-04-07 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2019-03-27 | Chinese | |
| 2018年度内部控制自我评价报告 | 2019-03-12 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2019
15 filings
| |||||
| 36772419 | 公开发行可转换公司债券预案 | 2019-04-08 | Chinese | ||
| 36772389 | 可转换公司债券持有人会议规则(2019年4月) | 2019-04-08 | Chinese | ||
| 36772378 | 2018年年度股东大会的法律意见书 | 2019-04-07 | Chinese | ||
| 36772370 | 2018年年度股东大会决议(已取消) | 2019-04-07 | Chinese | ||
| 36772363 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2019-03-27 | Chinese | ||
| 36772349 | 2018年度内部控制自我评价报告 | 2019-03-12 | Chinese | ||
| 36772343 | 独立董事关于第二届董事会第十一次会议相关事项的专项说明及独立意见 | 2019-03-12 | Chinese | ||
| 36772333 | 2018年年度报告 | 2019-03-12 | Chinese | ||
| 36772241 | 公司章程修订对照表 | 2019-03-12 | Chinese | ||
| 36772227 | 2019年度财务预算报告 | 2019-03-12 | Chinese | ||
| 36772215 | 关于公司非经营性资金占用及其他关联资金往来情况汇总表的专项审核报告 | 2019-03-12 | Chinese | ||
| 36772173 | 2018年年度审计报告 | 2019-03-12 | Chinese | ||
| 36771855 | 2018年年度报告摘要 | 2019-03-12 | Chinese | ||
| 36771847 | 2018年度监事会工作报告 | 2019-03-12 | Chinese | ||
| 36771837 | 2018年度财务决算报告 | 2019-03-12 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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