
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于募集资金使用完毕并注销募集资金专户的公告 | 2019-06-23 | Chinese | |
| 关于部分高级管理人员减持计划实施完毕的公告 | 2019-06-19 | Chinese | |
| 关于部分高级管理人员减持计划实施完毕的公告 | 2019-06-11 | Chinese | |
| 2019年第二次临时股东大会的法律意见书 | 2019-06-06 | Chinese | |
| 2019年第二次临时股东大会决议 | 2019-06-06 | Chinese | |
| 关于发行可转换公司债券获得国务院国资委批复的公告 | 2019-05-30 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2019
15 filings
| |||||
| 36772823 | 关于募集资金使用完毕并注销募集资金专户的公告 | 2019-06-23 | Chinese | ||
| 36772810 | 关于部分高级管理人员减持计划实施完毕的公告 | 2019-06-19 | Chinese | ||
| 36772796 | 关于部分高级管理人员减持计划实施完毕的公告 | 2019-06-11 | Chinese | ||
| 36772788 | 2019年第二次临时股东大会的法律意见书 | 2019-06-06 | Chinese | ||
| 36772774 | 2019年第二次临时股东大会决议 | 2019-06-06 | Chinese | ||
| 36772767 | 关于发行可转换公司债券获得国务院国资委批复的公告 | 2019-05-30 | Chinese | ||
| 36772754 | 关于召开2019年第二次临时股东大会的通知(更新后) | 2019-05-24 | Chinese | ||
| 36772740 | 关于临时股东大会通知的更正公告 | 2019-05-24 | Chinese | ||
| 36772734 | 第二届董事会第十三次会议决议(更新后) | 2019-05-24 | Chinese | ||
| 36772724 | 公司章程修订对照表 | 2019-05-21 | Chinese | ||
| 36772715 | 第二届董事会第十三次会议决议(已取消) | 2019-05-21 | Chinese | ||
| 36772705 | 公司章程(2019年5月) | 2019-05-21 | Chinese | ||
| 36772692 | 关于召开2019年第一次临时股东大会的通知(已取消) | 2019-05-21 | Chinese | ||
| 36772680 | 2018年年度权益分派实施公告 | 2019-05-12 | Chinese | ||
| 36772669 | 关于总会计师、副总经理减持公司股份的进展公告 | 2019-05-12 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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