
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于股东减持股份的预披露公告 | 2019-08-02 | Chinese | |
| 关于收到《中国证监会行政许可申请中止审查通知书》的公告 | 2019-07-26 | Chinese | |
| 2019年半年度业绩预告 | 2019-07-11 | Chinese | |
| 关于签订公开发行可转换公司债券保荐承销协议暨关联交易的公告 | 2019-07-09 | Chinese | |
| 关于公开发行可转换公司债券申请获得中国证监会受理的公告 | 2019-06-26 | Chinese | |
| 第二届董事会第十四次会议决议 | 2019-06-23 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2019
15 filings
| |||||
| 36772998 | 关于股东减持股份的预披露公告 | 2019-08-02 | Chinese | ||
| 36772987 | 关于收到《中国证监会行政许可申请中止审查通知书》的公告 | 2019-07-26 | Chinese | ||
| 36772973 | 2019年半年度业绩预告 | 2019-07-11 | Chinese | ||
| 36772966 | 关于签订公开发行可转换公司债券保荐承销协议暨关联交易的公告 | 2019-07-09 | Chinese | ||
| 36772954 | 关于公开发行可转换公司债券申请获得中国证监会受理的公告 | 2019-06-26 | Chinese | ||
| 36772944 | 第二届董事会第十四次会议决议 | 2019-06-23 | Chinese | ||
| 36772933 | 募集资金管理制度(2019年6月) | 2019-06-23 | Chinese | ||
| 36772923 | 独立董事工作制度(2019年6月) | 2019-06-23 | Chinese | ||
| 36772909 | 董事会薪酬与考核委员会工作细则(2019年6月) | 2019-06-23 | Chinese | ||
| 36772897 | 信息披露管理制度(2019年6月) | 2019-06-23 | Chinese | ||
| 36772888 | 董事会秘书工作细则(2019年6月) | 2019-06-23 | Chinese | ||
| 36772875 | 董事、监事和高级管理人员所持本公司股份及其变动管理制度(2019年6月) | 2019-06-23 | Chinese | ||
| 36772861 | 董事会提名委员会工作细则(2019年6月) | 2019-06-23 | Chinese | ||
| 36772849 | 董事会战略委员会工作细则(2019年6月) | 2019-06-23 | Chinese | ||
| 36772838 | 董事会议事规则(2019年6月) | 2019-06-23 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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