
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 独立董事关于第三届董事会第二次会议相关事项的独立意见 | 2021-04-12 | Chinese | |
| 独立董事关于第三届董事会第二次会议相关事项的事前认可意见 | 2021-04-12 | Chinese | |
| 第三届监事会第二次会议决议 | 2021-04-12 | Chinese | |
| 第三届董事会第二次会议决议 | 2021-04-12 | Chinese | |
| 关于参与竞拍土地使用权的公告 | 2021-04-12 | Chinese | |
| 国泰君安证券股份有限公司、中航证券有限公司关于公司向中航工业集团财务有限责任公司借款暨关联交易的核查意见 | 2021-04-12 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 36778684 | 独立董事关于第三届董事会第二次会议相关事项的独立意见 | 2021-04-12 | Chinese | ||
| 36778676 | 独立董事关于第三届董事会第二次会议相关事项的事前认可意见 | 2021-04-12 | Chinese | ||
| 36778667 | 第三届监事会第二次会议决议 | 2021-04-12 | Chinese | ||
| 36778660 | 第三届董事会第二次会议决议 | 2021-04-12 | Chinese | ||
| 36778651 | 关于参与竞拍土地使用权的公告 | 2021-04-12 | Chinese | ||
| 36778641 | 国泰君安证券股份有限公司、中航证券有限公司关于公司向中航工业集团财务有限责任公司借款暨关联交易的核查意见 | 2021-04-12 | Chinese | ||
| 36778629 | 2021年第一季度报告正文 | 2021-04-12 | Chinese | ||
| 36778614 | 关于为子公司提供担保的公告 | 2021-04-12 | Chinese | ||
| 36778604 | 关于与中航工业集团财务有限责任公司关联贷款的风险评估报告 | 2021-04-12 | Chinese | ||
| 36778593 | 关于向中航工业集团财务有限责任公司借款暨关联交易的公告 | 2021-04-12 | Chinese | ||
| 36778582 | 2021年第一季度报告全文 | 2021-04-12 | Chinese | ||
| 36778563 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2021-04-06 | Chinese | ||
| 36778554 | 关于增加日常关联交易预计的公告 | 2021-04-06 | Chinese | ||
| 36778550 | 2020年年度股东大会的法律意见书 | 2021-04-06 | Chinese | ||
| 36778538 | 2020年年度股东大会决议公告 | 2021-04-06 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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