
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于投资建设广州封装基板生产基地项目的公告 | 2021-06-23 | Chinese | |
| 关于召开2021年第二次临时股东大会的通知 | 2021-06-23 | Chinese | |
| 关于拟参与竞拍土地使用权的公告 | 2021-06-23 | Chinese | |
| 第三届董事会第三次会议决议 | 2021-06-23 | Chinese | |
| 关于签订项目投资合作协议的公告 | 2021-06-23 | Chinese | |
| 北京市嘉源律师事务所关于深南电路股份有限公司回购注销部分限制性股票的法律意见书 | 2021-06-23 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 36778837 | 关于投资建设广州封装基板生产基地项目的公告 | 2021-06-23 | Chinese | ||
| 36778825 | 关于召开2021年第二次临时股东大会的通知 | 2021-06-23 | Chinese | ||
| 36778818 | 关于拟参与竞拍土地使用权的公告 | 2021-06-23 | Chinese | ||
| 36778810 | 第三届董事会第三次会议决议 | 2021-06-23 | Chinese | ||
| 36778803 | 关于签订项目投资合作协议的公告 | 2021-06-23 | Chinese | ||
| 36778800 | 北京市嘉源律师事务所关于深南电路股份有限公司回购注销部分限制性股票的法律意见书 | 2021-06-23 | Chinese | ||
| 36778789 | 关于成立全资子公司的公告 | 2021-06-23 | Chinese | ||
| 36778780 | 独立董事关于第三届董事会第三次会议相关事项的独立意见 | 2021-06-23 | Chinese | ||
| 36778771 | 第三届监事会第三次会议决议 | 2021-06-23 | Chinese | ||
| 36778764 | 关于回购注销A股限制性股票激励计划(第一期)部分限制性股票的公告 | 2021-06-23 | Chinese | ||
| 36778757 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2021-06-21 | Chinese | ||
| 36778746 | 2020年年度权益分派实施公告 | 2021-05-24 | Chinese | ||
| 36778734 | 关于A股限制性股票激励计划(第一期)部分限制性股票回购注销完成的公告 | 2021-05-21 | Chinese | ||
| 36778726 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2021-05-13 | Chinese | ||
| 36778693 | 国泰君安证券股份有限公司、中航证券有限公司关于公司持续督导期间培训总结 | 2021-04-12 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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