Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于召开2023年第一次临时股东大会的通知 | 2023-03-21 | Chinese | |
| 公司章程（2023年3月） | 2023-03-21 | Chinese | |
| 关于变更注册资本并修订《公司章程》的公告 | 2023-03-21 | Chinese | |
| 第四届董事会第三十一次会议决议公告 | 2023-03-21 | Chinese | |
| 关于瑞典子公司收购Corem Science Fastighets AB 100%股权的公告 | 2023-03-16 | Chinese | |
| 关于子公司为其子公司申请银行并购相关贷款提供担保的公告 | 2023-03-16 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37280449 | 关于召开2023年第一次临时股东大会的通知 | 2023-03-21 | Chinese | ||
| 37280437 | 公司章程（2023年3月） | 2023-03-21 | Chinese | ||
| 37280417 | 关于变更注册资本并修订《公司章程》的公告 | 2023-03-21 | Chinese | ||
| 37280409 | 第四届董事会第三十一次会议决议公告 | 2023-03-21 | Chinese | ||
| 37280404 | 关于瑞典子公司收购Corem Science Fastighets AB 100%股权的公告 | 2023-03-16 | Chinese | ||
| 37280392 | 关于子公司为其子公司申请银行并购相关贷款提供担保的公告 | 2023-03-16 | Chinese | ||
| 37280383 | 关于瑞典子公司向银行申请并购相关贷款的公告 | 2023-03-16 | Chinese | ||
| 37280373 | 第四届董事会第三十次会议决议公告 | 2023-03-16 | Chinese | ||
| 37280365 | 关于2021年限制性股票激励计划首次授予部分第一个归属期归属结果暨股份上市的公告 | 2023-03-15 | Chinese | ||
| 37280357 | 关于签订募集资金四方监管协议的公告 | 2023-02-28 | Chinese | ||
| 37280349 | 关于控股股东、实际控制人减持股份比例达到1%的公告 | 2023-02-23 | Chinese | ||
| 37280339 | 关于控股子公司通过高新技术企业认定的公告 | 2023-02-21 | Chinese | ||
| 37280332 | 关于控股股东股票质押式回购交易提前购回的公告 | 2023-02-20 | Chinese | ||
| 37280323 | 关于控股股东、实际控制人减持计划的预披露公告 | 2023-02-17 | Chinese | ||
| 37280315 | 关于共同投资设立的智能传感产业基金完成工商注册登记的公告 | 2023-02-16 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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