Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公司章程（2023年3月） | 2023-03-28 | Chinese | |
| 董事会决议公告 | 2023-03-28 | Chinese | |
| 2022年度内部控制自我评价报告 | 2023-03-28 | Chinese | |
| 2022年年度报告披露提示性公告 | 2023-03-28 | Chinese | |
| 监事会决议公告 | 2023-03-28 | Chinese | |
| 关于变更注册资本并修订《公司章程》的公告 | 2023-03-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37280952 | 公司章程（2023年3月） | 2023-03-28 | Chinese | ||
| 37280933 | 董事会决议公告 | 2023-03-28 | Chinese | ||
| 37280922 | 2022年度内部控制自我评价报告 | 2023-03-28 | Chinese | ||
| 37280912 | 2022年年度报告披露提示性公告 | 2023-03-28 | Chinese | ||
| 37280902 | 监事会决议公告 | 2023-03-28 | Chinese | ||
| 37280893 | 关于变更注册资本并修订《公司章程》的公告 | 2023-03-28 | Chinese | ||
| 37280886 | 关于公司2022年度营业收入扣除情况的专项审核报告 | 2023-03-28 | Chinese | ||
| 37280877 | 2023年度董事、监事、高级管理人员薪酬方案 | 2023-03-28 | Chinese | ||
| 37280871 | 关于开展外汇衍生品交易业务的公告 | 2023-03-28 | Chinese | ||
| 37280859 | 关于回购注销部分已授予但尚未解除限售的限制性股票的公告 | 2023-03-28 | Chinese | ||
| 37280846 | 关于2022年度募集资金存放与使用情况的专项报告 | 2023-03-28 | Chinese | ||
| 37280832 | 2022年度财务决算报告 | 2023-03-28 | Chinese | ||
| 37280825 | 关于2022年度计提信用及资产减值损失的公告 | 2023-03-28 | Chinese | ||
| 37280814 | 关于开展外汇衍生品交易业务的可行性分析报告 | 2023-03-28 | Chinese | ||
| 37280808 | 北京市中伦律师事务所关于公司2021年限制性股票激励计划回购注销及作废部分限制性股票相关事项的法律意见书 | 2023-03-28 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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