Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于2021年限制性股票激励计划首次授予部分第一个解除限售期解除限售股份上市流通的提示性公告 | 2023-02-14 | Chinese | |
| 关于控股股东部分股票质押展期的公告 | 2023-02-13 | Chinese | |
| 关于控股股东部分股票质押到期的公告 | 2023-02-05 | Chinese | |
| 关于全资子公司对外投资设立参股子公司并完成工商注册登记的公告 | 2023-02-05 | Chinese | |
| 2022年年度业绩预告 | 2023-01-30 | Chinese | |
| 关于收购汽车芯片制造产线交易签署《股权收购协议终止协议》的公告 | 2023-01-20 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37280310 | 关于2021年限制性股票激励计划首次授予部分第一个解除限售期解除限售股份上市流通的提示性公告 | 2023-02-14 | Chinese | ||
| 37280301 | 关于控股股东部分股票质押展期的公告 | 2023-02-13 | Chinese | ||
| 37280291 | 关于控股股东部分股票质押到期的公告 | 2023-02-05 | Chinese | ||
| 37280279 | 关于全资子公司对外投资设立参股子公司并完成工商注册登记的公告 | 2023-02-05 | Chinese | ||
| 37280270 | 2022年年度业绩预告 | 2023-01-30 | Chinese | ||
| 37280260 | 关于收购汽车芯片制造产线交易签署《股权收购协议终止协议》的公告 | 2023-01-20 | Chinese | ||
| 37280252 | 中泰证券股份有限公司关于公司2022年持续督导培训情况报告 | 2023-01-16 | Chinese | ||
| 37280244 | 关于公司及子公司向银行申请综合授信额度的公告 | 2023-01-12 | Chinese | ||
| 37280240 | 独立董事关于第四届董事会第二十九次会议相关事项的事前认可意见 | 2023-01-12 | Chinese | ||
| 37280230 | 关于控股股东为公司及子公司申请银行授信提供关联担保的公告 | 2023-01-12 | Chinese | ||
| 37280218 | 第四届监事会第二十四次会议决议公告 | 2023-01-12 | Chinese | ||
| 37280201 | 第四届董事会第二十九次会议决议公告 | 2023-01-12 | Chinese | ||
| 37280193 | 关于为子公司申请银行授信提供担保的公告 | 2023-01-12 | Chinese | ||
| 37280184 | 独立董事关于第四届董事会第二十九次会议相关事项的独立意见 | 2023-01-12 | Chinese | ||
| 37280175 | 中泰证券股份有限公司关于公司控股股东为公司及子公司申请银行授信提供关联担保的核查意见 | 2023-01-12 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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