Ingenic Semiconductor Co., Ltd — Investor Relations & Filings
Ingenic Semiconductor Co., Ltd. is a fabless semiconductor company specializing in the development of high-performance, low-power System-on-Chip (SoC) solutions and advanced memory products. The company leverages its proprietary XBurst CPU technology, based on the MIPS architecture, to deliver energy-efficient processing for a wide range of applications. Its product portfolio includes video processors, AIoT controllers, and high-reliability memory solutions such as DRAM, SRAM, and Flash memory, following the strategic acquisition of Integrated Silicon Solution, Inc. (ISSI). Ingenic serves diverse global markets, including automotive electronics, industrial automation, medical devices, smart home systems, and wearable technology. The company is recognized for its ability to integrate sophisticated processing capabilities with specialized memory, providing robust hardware platforms for mission-critical and battery-operated devices.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 独立董事关于公司第四届董事会第二十次会议相关事项的独立意见 | 2021-04-14 | Chinese | |
| 2021年度向特定对象发行股票方案论证分析报告 | 2021-04-14 | Chinese | |
| 截至2020年12月31日止前次募集资金使用情况鉴证报告 | 2021-04-14 | Chinese | |
| 第四届董事会第二十次会议决议公告 | 2021-04-14 | Chinese | |
| 关于未来三年(2021-2023年)股东分红回报规划的公告 | 2021-04-14 | Chinese | |
| 关于2021年度向特定对象发行股票摊薄即期回报、填补回报措施及相关主体承诺的公告 | 2021-04-14 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 36078352 | 独立董事关于公司第四届董事会第二十次会议相关事项的独立意见 | 2021-04-14 | Chinese | ||
| 36078336 | 2021年度向特定对象发行股票方案论证分析报告 | 2021-04-14 | Chinese | ||
| 36078322 | 截至2020年12月31日止前次募集资金使用情况鉴证报告 | 2021-04-14 | Chinese | ||
| 36078319 | 第四届董事会第二十次会议决议公告 | 2021-04-14 | Chinese | ||
| 36078291 | 关于未来三年(2021-2023年)股东分红回报规划的公告 | 2021-04-14 | Chinese | ||
| 36078281 | 关于2021年度向特定对象发行股票摊薄即期回报、填补回报措施及相关主体承诺的公告 | 2021-04-14 | Chinese | ||
| 36078271 | 2021年度向特定对象发行股票募集资金使用可行性分析报告 | 2021-04-14 | Chinese | ||
| 36078256 | 关于2021年度向特定对象发行股票预案披露的提示性公告 | 2021-04-14 | Chinese | ||
| 36078249 | 关于本次向特定对象发行股票不存在直接或通过利益相关方向参与认购的投资者提供财务资助或补偿事宜的公告 | 2021-04-14 | Chinese | ||
| 36078236 | 关于召开2020年年度股东大会的通知 | 2021-04-14 | Chinese | ||
| 36078217 | 第四届监事会第十七次会议决议公告 | 2021-04-14 | Chinese | ||
| 36078206 | 独立董事关于公司第四届董事会第二十次会议相关事项的事先认可意见 | 2021-04-14 | Chinese | ||
| 36078190 | 2020年年度报告 | 2021-03-29 | Chinese | ||
| 36077917 | 2020年度审计报告 | 2021-03-29 | Chinese | ||
| 36077864 | 北京君正集成电路股份有限公司2020年12月31日内部控制鉴证报告 | 2021-03-29 | Chinese | ||
Market data
Market data not available
Price history
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Ingenic Semiconductor Co., Ltd via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55229/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55229 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55229 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55229 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55229}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Ingenic Semiconductor Co., Ltd (id: 55229)"
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