HALO MICROELECTRONICS CO.,LTD. — Investor Relations & Filings
About HALO MICROELECTRONICS CO.,LTD.
Halo Microelectronics Co., Ltd. is a fabless semiconductor company specializing in the design and development of high-performance analog and mixed-signal integrated circuits. The company focuses on power management and signal chain solutions, offering a diverse portfolio that includes battery management systems, high-efficiency DC-DC converters, and advanced fast-charging ICs. Its products are engineered for high power density and energy efficiency, catering primarily to the consumer electronics, automotive, and industrial sectors. Halo Microelectronics is recognized for its proprietary switched-capacitor architecture and integrated power delivery technologies, which support rapid charging and extended battery life in mobile devices and electric vehicles. The company provides comprehensive power management solutions that address the evolving requirements of high-performance computing and portable electronics.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 希荻微关于深圳市诚芯微科技有限公司2025年度业绩承诺实现情况的公告 | 2026-04-29 | Chinese | |
| 希荻微董事会薪酬与考核委员会关于2024年股票期权激励计划首次授予部分第二个行权期可行权激励对象名单的核查意见 | 2026-04-29 | Chinese | |
| 立信会计师事务所(特殊普通合伙)关于深圳市诚芯微科技有限公司2025年度业绩承诺完成情况的专项审核报告 | 2026-04-29 | Chinese | |
| 希荻微第二届董事会第三十四次会议决议公告 | 2026-04-29 | Chinese | |
| 希荻微关于2024年股票期权激励计划首次授予部分第二个行权期行权条件成就的公告 | 2026-04-29 | Chinese | |
| 希荻微关于部分募投项目结项并将节余募集资金永久补充流动资金的公告-2026-050 | 2026-04-22 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 39499573 | 希荻微关于深圳市诚芯微科技有限公司2025年度业绩承诺实现情况的公告 | 2026-04-29 | Chinese | ||
| 39499565 | 希荻微董事会薪酬与考核委员会关于2024年股票期权激励计划首次授予部分第二个行权期可行权激励对象名单的核查意见 | 2026-04-29 | Chinese | ||
| 39499560 | 立信会计师事务所(特殊普通合伙)关于深圳市诚芯微科技有限公司2025年度业绩承诺完成情况的专项审核报告 | 2026-04-29 | Chinese | ||
| 39499551 | 希荻微第二届董事会第三十四次会议决议公告 | 2026-04-29 | Chinese | ||
| 39499543 | 希荻微关于2024年股票期权激励计划首次授予部分第二个行权期行权条件成就的公告 | 2026-04-29 | Chinese | ||
| 39499537 | 希荻微关于部分募投项目结项并将节余募集资金永久补充流动资金的公告-2026-050 | 2026-04-22 | Chinese | ||
| 39499536 | 希荻微关于原实际控制人股份继承过户的进展公告 | 2026-04-22 | Chinese | ||
| 39499528 | 希荻微董事会薪酬与考核委员会关于2026年股票期权激励计划首次授予激励对象名单的核查意见及公示情况说明 | 2026-04-22 | Chinese | ||
| 39499523 | 希荻微关于召开2025年度暨2026年第一季度业绩说明会的公告 | 2026-04-22 | Chinese | ||
| 39499513 | 希荻微2025年年度股东会会议资料 | 2026-04-20 | Chinese | ||
| 34825203 | 希荻微关于现金收购深圳市诚芯微科技有限公司100%股权进展暨交易对方完成股份质押登记的公告 | 2026-04-17 | Chinese | ||
| 39499506 | 希荻微2025年度董事会审计委员会履职情况报告 | 2026-04-16 | Chinese | ||
| 39499502 | 希荻微2025年年度报告摘要 | 2026-04-16 | Chinese | ||
| 39499501 | 希荻微关于提请股东会授权董事会办理小额快速融资相关事宜的公告 | 2026-04-16 | Chinese | ||
| 39499498 | 希荻微2025年度环境、社会与公司治理(ESG)报告摘要 | 2026-04-16 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
HALO MICROELECTRONICS CO.,LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58207/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58207 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58207 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58207 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58207}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HALO MICROELECTRONICS CO.,LTD. (id: 58207)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.