Tong Hsing Electronic Industries, Ltd. — Investor Relations & Filings
Tong Hsing Electronic Industries, Ltd. specializes in the development and manufacture of custom semiconductor micro-module packaging and advanced ceramic substrates. Utilizing core competencies in thick and thin film technologies, the company provides high-reliability solutions including Direct Plated Copper (DPC) and Active Metal Brazing (AMB) substrates. Its service offerings encompass multi-chip module miniaturization, hybrid integrated circuits, and comprehensive wafer-level services such as testing, grinding, and reconstruction. Tong Hsing’s products are integral to high-growth sectors including wireless communications, automotive electronics, MEMS, image sensors, and medical devices. The company focuses on high-power applications, supporting electric vehicle systems, high-brightness LEDs, and aerospace components through advanced thermal management and precision circuit patterning.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 114年第4季財務報告書 — 202504_6271_AIC.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AIA.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AI3.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AI1.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202503_6271_AIA.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202503_6271_AI1.pdf | 2026-05-06 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 41726390 | 114年第4季財務報告書 — 202504_6271_AIC.pdf | 2026-05-06 | Chinese | ||
| 41726365 | 114年第4季財務報告書 — 202504_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726340 | 114年第4季財務報告書 — 202504_6271_AI3.pdf | 2026-05-06 | Chinese | ||
| 41726301 | 114年第4季財務報告書 — 202504_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726262 | 114年第4季財務報告書 — 202503_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726237 | 114年第4季財務報告書 — 202503_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726202 | 114年第4季財務報告書 — 202502_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726186 | 114年第4季財務報告書 — 202502_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726154 | 114年第4季財務報告書 — 202501_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726132 | 114年第4季財務報告書 — 202501_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41459144 | 115年04月內部人持股異動(事後) | 2026-05-05 | Chinese | ||
| 41456819 | 115年04月董事會成員及持股 | 2026-05-05 | Chinese | ||
| 38033792 | 115年第1季財務報告書 — 202601_6271_AI1.pdf | 2026-04-28 | Chinese | ||
| 37974041 | 115年第1季海外子公司投資 | 2026-04-28 | Chinese | ||
| 37871075 | 115年第1季權益變動表 | 2026-04-28 | English | ||
Market data
Market data not available
Price history
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Tong Hsing Electronic Industries, Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52546/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52546 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52546 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52546 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52546}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Tong Hsing Electronic Industries, Ltd. (id: 52546)"
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