
THEIL — Investor Relations & Filings
Tong Hsing Electronic Industries, Ltd. specializes in the development and manufacture of custom semiconductor micro-module packaging and advanced ceramic substrates. Utilizing core competencies in thick and thin film technologies, the company provides high-reliability solutions including Direct Plated Copper (DPC) and Active Metal Brazing (AMB) substrates. Its service offerings encompass multi-chip module miniaturization, hybrid integrated circuits, and comprehensive wafer-level services such as testing, grinding, and reconstruction. Tong Hsing’s products are integral to high-growth sectors including wireless communications, automotive electronics, MEMS, image sensors, and medical devices. The company focuses on high-power applications, supporting electric vehicle systems, high-brightness LEDs, and aerospace components through advanced thermal management and precision circuit patterning.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公告本公司處分理財商品 | 2026-04-15 | Chinese | |
| 本公司董事會通過發行認股價格低於市價之員工認股權憑證 | 2026-04-14 | Chinese | |
| 公告本公司董事會決議增資⼦公司TONG HSING ELECTRONICS PHILS. INC. | 2026-04-14 | Chinese | |
| 本公司董事會決議召開115年股東會(新增討論案) | 2026-04-14 | Chinese | |
| 115年04月法人說明會簡報 — 627120260414E001.pdf | 2026-04-14 | English | |
| 115年04月法人說明會簡報 — 627120260414M001.pdf | 2026-04-14 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 34568086 | 公告本公司處分理財商品 | 2026-04-15 | Chinese | ||
| 34491935 | 本公司董事會通過發行認股價格低於市價之員工認股權憑證 | 2026-04-14 | Chinese | ||
| 34489427 | 公告本公司董事會決議增資⼦公司TONG HSING ELECTRONICS PHILS. INC. | 2026-04-14 | Chinese | ||
| 34489430 | 本公司董事會決議召開115年股東會(新增討論案) | 2026-04-14 | Chinese | ||
| 34471498 | 115年04月法人說明會簡報 — 627120260414E001.pdf | 2026-04-14 | English | ||
| 34471469 | 115年04月法人說明會簡報 — 627120260414M001.pdf | 2026-04-14 | Chinese | ||
| 34471439 | 115年04月法人說明會簡報 | 2026-04-14 | Chinese | ||
| 34471523 | 公告本公司董事會通過115年度第一季合併財務報告 | 2026-04-14 | Chinese | ||
| 33899669 | 公告本公司處分理財商品 | 2026-04-09 | Chinese | ||
| 33887950 | 公告民國115年度3月份本公司合併營收淨額 | 2026-04-09 | Chinese | ||
| 33887997 | 115年3月背書保證與資金貸與 | 2026-04-09 | Chinese | ||
| 33887996 | 115年3月營業收入 | 2026-04-09 | Chinese | ||
| 33772630 | 公告本公司受邀參加凱基證券舉辦之法人說明會 | 2026-04-08 | Chinese | ||
| 33772643 | 115年04月法人說明會簡報 | 2026-04-08 | Chinese | ||
| 33768298 | 115年03月內部人持股異動(事後) | 2026-04-08 | Chinese | ||
Market data
Market data not available
Price history
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THEIL via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52546/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52546 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52546 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52546 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52546}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for THEIL (id: 52546)"
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