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Sunshine Global Circuits Co., Ltd. — Investor Relations & Filings

Ticker · 300739 ISIN · CNE1000035Y6 Shenzhen Stock Exchange Manufacturing
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Filings indexed 1,667 across all filing types
Latest filing 2018-01-14 Capital/Financing Update
Country CN China
Listing Shenzhen Stock Exchange 300739

About Sunshine Global Circuits Co., Ltd.

https://www.sunshinepcb.com

Sunshine Global Circuits Co., Ltd. specializes in the research, development, production, and sale of high-precision printed circuit boards (PCBs). The company's product portfolio includes high-density interconnect (HDI) boards, multilayer rigid PCBs, flexible circuits, and rigid-flex boards. These products are engineered to meet the stringent requirements of sectors such as automotive electronics, industrial automation, medical devices, and telecommunications infrastructure. Sunshine Global Circuits emphasizes advanced manufacturing processes and technical innovation to support high-frequency and high-speed applications. The company maintains a global service network, providing comprehensive technical support and supply chain solutions to international original equipment manufacturers (OEMs) and electronic manufacturing services (EMS) providers.

Recent filings

Filing Released Lang Actions
首次公开发行股票并在创业板上市提示公告
Capital/Financing Update Classification · 100% confidence The document is an announcement regarding the initial public offering (IPO) of Shenzhen Mingyang Circuit Technology Co., Ltd., including details about the stock issuance, subscription process, pricing, and payment dates. It mentions the approval by the China Securities Regulatory Commission and provides procedural information for investors. The document does not contain financial statements or detailed financial performance data but rather informs about the IPO process and related investor instructions. This fits the category of Capital/Financing Update (CAP), which covers updates on company fundraising and capital structure changes such as IPOs.
2018-01-14 Chinese
首次公开发行股票并在创业板上市初步询价及推介公告
Capital/Financing Update Classification · 95% confidence The document is a detailed announcement regarding the initial public offering (IPO) of Shenzhen Mingyang Circuit Technology Co., Ltd., including the preliminary inquiry, pricing, subscription procedures, investor qualifications, and issuance schedule. It references regulatory frameworks for IPOs, specific dates for subscription and pricing, and detailed rules for investor participation. The document is not a financial report, earnings release, or management discussion, but rather a comprehensive announcement about the IPO process and related arrangements. It is not a simple notice or a brief announcement but a full detailed disclosure about the IPO issuance and subscription process. This fits the category of Capital/Financing Update (CAP), which covers updates on company fundraising and financing activities such as IPOs.
2018-01-14 Chinese
招商证券股份有限公司关于公司首次公开发行股票并在创业板上市之发行保荐书
Capital/Financing Update Classification · 95% confidence The document is a detailed issuance sponsorship letter (发行保荐书) related to the initial public offering (IPO) and listing of Shenzhen Mingyang Circuit Technology Co., Ltd. on the ChiNext board (创业板). It includes extensive information about the issuer, the sponsor institution, legal and financial compliance, governance, financial performance over multiple years, risk factors, and regulatory compliance with Chinese securities laws and regulations. The document is lengthy (15,000 characters) and contains substantive financial data, audit references, and detailed company and issuance information. This type of document is typical of a prospectus or issuance sponsorship document related to an IPO, which falls under capital/financing activities. It is not an annual report, audit report, earnings release, or other categories. Therefore, the most appropriate classification is Capital/Financing Update (CAP).
2018-01-14 Chinese
控制股东及实际控制人对招股意向书的确认意见
Regulatory Filings
2018-01-14 Chinese
关于公司设立以来股本演变情况的说明及其董事、监事、高级管理人员的确认意见
Capital/Financing Update Classification · 95% confidence The document is titled as an application file for the initial public offering (IPO) and listing on the ChiNext board, focusing on the explanation of the company's share capital evolution since its establishment. It contains detailed historical data on capital increases, share transfers, and changes in shareholder structure, including audit and valuation reports related to net assets and capital. The content is comprehensive and relates to the company's capital structure changes and shareholding history, which is typical for IPO application documents or capital/financing updates. There is no indication that this is a full annual report, earnings release, or management discussion. The document is not a brief announcement but a detailed explanation of share capital evolution and related confirmations by directors and senior management. Given the focus on share capital changes and the IPO application context, the most appropriate classification is Capital/Financing Update (CAP).
2018-01-14 Chinese
内部控制鉴证报告
Regulatory Filings
2018-01-14 Chinese

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