
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2023年第二次临时股东大会法律意见书 | 2023-12-11 | Chinese | |
| 2023年第二次临时股东大会决议公告 | 2023-12-11 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2023-11-29 | Chinese | |
| 提名委员会工作细则(2023年11月) | 2023-11-23 | Chinese | |
| 募集资金管理制度(2023年11月) | 2023-11-23 | Chinese | |
| 审计委员会工作细则(2023年11月) | 2023-11-23 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 36786440 | 2023年第二次临时股东大会法律意见书 | 2023-12-11 | Chinese | ||
| 36786432 | 2023年第二次临时股东大会决议公告 | 2023-12-11 | Chinese | ||
| 36786417 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2023-11-29 | Chinese | ||
| 36786404 | 提名委员会工作细则(2023年11月) | 2023-11-23 | Chinese | ||
| 36786395 | 募集资金管理制度(2023年11月) | 2023-11-23 | Chinese | ||
| 36786384 | 审计委员会工作细则(2023年11月) | 2023-11-23 | Chinese | ||
| 36786372 | 独立董事工作制度(2023年11月) | 2023-11-23 | Chinese | ||
| 36786358 | 关联交易管理制度(2023年11月) | 2023-11-23 | Chinese | ||
| 36786350 | 关于召开2023年第二次临时股东大会的通知 | 2023-11-23 | Chinese | ||
| 36786339 | 独立董事年报工作制度(2023年11月) | 2023-11-23 | Chinese | ||
| 36786328 | 关于投资建设泰国工厂的公告 | 2023-11-23 | Chinese | ||
| 36786317 | 公司章程(2023年11月) | 2023-11-23 | Chinese | ||
| 36786299 | 对外担保管理制度 (2023年11月) | 2023-11-23 | Chinese | ||
| 36786287 | 薪酬与考核委员会工作细则(2023年11月) | 2023-11-23 | Chinese | ||
| 36786268 | 公司章程修订对照表 | 2023-11-23 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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