
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 审计委员会对会计师事务所2023年度履职情况评估及履行监督职责情况报告 | 2024-03-14 | Chinese | |
| 独立董事提名人声明与承诺(张汉斌) | 2024-03-14 | Chinese | |
| 涉及财务公司关联交易的存款、贷款等金融业务的专项说明 | 2024-03-14 | Chinese | |
| 董事会决议公告 | 2024-03-14 | Chinese | |
| 2023年度内部控制审计报告 | 2024-03-14 | Chinese | |
| 独立董事候选人声明与承诺(于洪宇) | 2024-03-14 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 36787837 | 审计委员会对会计师事务所2023年度履职情况评估及履行监督职责情况报告 | 2024-03-14 | Chinese | ||
| 36787834 | 独立董事提名人声明与承诺(张汉斌) | 2024-03-14 | Chinese | ||
| 36787822 | 涉及财务公司关联交易的存款、贷款等金融业务的专项说明 | 2024-03-14 | Chinese | ||
| 36787785 | 董事会决议公告 | 2024-03-14 | Chinese | ||
| 36787777 | 2023年度内部控制审计报告 | 2024-03-14 | Chinese | ||
| 36787722 | 独立董事候选人声明与承诺(于洪宇) | 2024-03-14 | Chinese | ||
| 36787712 | 独立董事提名人声明与承诺(于洪宇) | 2024-03-14 | Chinese | ||
| 36787695 | 2023年年度审计报告 | 2024-03-14 | Chinese | ||
| 36786826 | 董事会对独立董事独立性评估的专项意见 | 2024-03-14 | Chinese | ||
| 36786817 | 关于与中航工业集团财务有限责任公司关联存贷款的风险持续评估报告 | 2024-03-14 | Chinese | ||
| 36786805 | 2024年度财务预算报告 | 2024-03-14 | Chinese | ||
| 36786794 | 2023年度独立董事述职报告(张汉斌) | 2024-03-14 | Chinese | ||
| 36786780 | 2023年度独立董事述职报告(于洪宇) | 2024-03-14 | Chinese | ||
| 36786772 | 2023年度募集资金存放与使用情况的专项报告 | 2024-03-14 | Chinese | ||
| 36786760 | 关于举办2023年度网上业绩说明会并征集相关问题的公告 | 2024-03-14 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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