
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-08-15 | Chinese | |
| 2024年半年度业绩预告 | 2024-07-09 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-07-02 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-06-07 | Chinese | |
| 2023年年度权益分派实施公告 | 2024-05-22 | Chinese | |
| 第四届监事会第一次会议决议 | 2024-04-18 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 36788486 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-08-15 | Chinese | ||
| 36788461 | 2024年半年度业绩预告 | 2024-07-09 | Chinese | ||
| 36788446 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-07-02 | Chinese | ||
| 36788431 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-06-07 | Chinese | ||
| 36788407 | 2023年年度权益分派实施公告 | 2024-05-22 | Chinese | ||
| 36788395 | 第四届监事会第一次会议决议 | 2024-04-18 | Chinese | ||
| 36788385 | 第四届董事会第一次会议决议 | 2024-04-18 | Chinese | ||
| 36788369 | 2023年年度股东大会决议公告 | 2024-04-18 | Chinese | ||
| 36788358 | 关于职工代表监事换届选举的公告 | 2024-04-18 | Chinese | ||
| 36788349 | 2023年年度股东大会法律意见书 | 2024-04-18 | Chinese | ||
| 36788338 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-04-17 | Chinese | ||
| 36788325 | 第三届监事会第二十二次会议决议 | 2024-04-15 | Chinese | ||
| 36788314 | 2024年一季度报告 | 2024-04-15 | Chinese | ||
| 36788302 | 第三届董事会第二十九次会议决议 | 2024-04-15 | Chinese | ||
| 36788290 | 关于在泰国投资建设工厂的进展公告 | 2024-04-10 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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