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Kinsus Interconnect Technology Corp. — Investor Relations & Filings

Ticker · 3189 TW Manufacturing
Filings indexed 2,536 across all filing types
Latest filing 2026-04-30 Regulatory Filings
Country TW Taiwan
Listing TW 3189

About Kinsus Interconnect Technology Corp.

https://www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
公告本公司115年第1季財務報告董事會召開日期為115年05月08日
Regulatory Filings
2026-04-30 Chinese
115年年報及股東會資料 — 2026_3189_20260527FE2.pdf
AGM Information Classification · 1% confidence The document is a comprehensive “Handbook for the 2026 Annual Meeting of Shareholders,” containing meeting procedures, agendas, items to be reported/approved/discussed, and attachments such as the 2025 Business Report, Audit Committee’s Review Report, audited financial statements, earnings distribution schedule, and articles of incorporation amendments. It is clearly materials prepared for and shared at an Annual General Meeting. This matches the definition of AGM Information (Code: AGM-R).
2026-04-24 English
115年年報及股東會資料 — 2026_3189_20260527FE1.pdf
Proxy Solicitation & Information Statement Classification · 1% confidence The document is a formal notice to shareholders of the 2026 Annual Shareholders’ Meeting, including meeting agenda items, proposed resolutions (e.g., earnings distribution, amendments, private placement), and explanatory notes in an appendix. It is sent to solicit votes and inform shareholders of matters to be voted upon. This matches the definition of a Proxy Solicitation & Information Statement rather than an AGM presentation or simple announcement.
2026-04-24 English
115年年報及股東會資料 — 2026_3189_20260527F13.pdf
AGM Information Classification · 1% confidence The document is titled “115年股東常會各項議案參考資料” and lays out the agenda items, proposals, background explanations, and attachments for the company’s Annual General Meeting. It provides the materials and presentation content for shareholders’ approval and discussion at the AGM rather than constituting the full annual report, proxy solicitation statement, or financial statements themselves. Therefore, it is best classified as AGM Information (AGM-R).
2026-04-24 Chinese
115年年報及股東會資料 — 2026_3189_20260527F02.pdf
Regulatory Filings
2026-04-24 Chinese
115年年報及股東會資料 — 2026_3189_20260527F01.pdf
Proxy Solicitation & Information Statement Classification · 1% confidence The document is a comprehensive shareholder meeting notice for the ’115th Annual General Meeting’ of 景碩科技股份有限公司. It includes the meeting date, agenda items (114年度營業報告、決算表、盈餘分配、章程修訂、私募增資等), proxy forms, attendance notices, dividend election form, and instructions for electronic voting. This matches the Proxy Solicitation & Information Statement category (materials sent to shareholders to provide information and request votes for meetings). It is not a presentation deck used at the AGM (AGM-R), nor a regulatory announcement or a brief report, but rather full pre-meeting materials for soliciting proxies and informing shareholders about the proposals.
2026-04-24 Chinese

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