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Kinsus Interconnect Technology Corp. — Investor Relations & Filings

Ticker · 3189 TW Manufacturing
Open in API
Filings indexed 2,536 across all filing types
Latest filing 2026-03-31 Share Issue/Capital Cha…
Country TW Taiwan
Listing TW 3189

About Kinsus Interconnect Technology Corp.

https://www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
115年3月變更登記
Share Issue/Capital Change Classification · 1% confidence The document is from Taiwan’s Market Observation Post System (公開資訊觀測站) and details the company’s authorized capital, paid‐in capital, sources of capital increases, and approval dates. It is an announcement of a corporate capital change rather than a full financial report or other disclosure. This corresponds to “Share Issue/Capital Change” (Code: SHA).
2026-03-31 Chinese
公司基本資料
Regulatory Filings Classification · 1% confidence The document is a standardized corporate disclosure of basic company information (ticker, industry, address, management, auditors, capital, listing dates, etc.) submitted to Taiwan’s “公開資訊觀測站”. It does not present financial results, meeting materials, management commentary, or any specific transaction. It is a general regulatory filing of company profile data and therefore falls under the fallback category “Regulatory Filings (RNS).”
2026-03-31 Chinese
係因本公司有價證券於集中交易市場達公布注意交易資訊標 準，故公布相關財務業務等重大訊息，以利投資人區別瞭解
Regulatory Filings
2026-03-18 Chinese
公告本公司114年現金增資收足股款暨增資基準日
Regulatory Filings
2026-03-16 Chinese
114年度財務比率
Regulatory Filings
2026-03-13 Chinese
澄清媒體報導
Regulatory Filings
2026-03-13 Chinese

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