Kinsus Interconnect Technology Corp. — Investor Relations & Filings
Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公告本公司115年第1季財務報告董事會召開日期為115年05月08日 | 2026-04-30 | Chinese | |
| 115年年報及股東會資料 — 2026_3189_20260527FE2.pdf | 2026-04-24 | English | |
| 115年年報及股東會資料 — 2026_3189_20260527FE1.pdf | 2026-04-24 | English | |
| 115年年報及股東會資料 — 2026_3189_20260527F13.pdf | 2026-04-24 | Chinese | |
| 115年年報及股東會資料 — 2026_3189_20260527F02.pdf | 2026-04-24 | Chinese | |
| 115年年報及股東會資料 — 2026_3189_20260527F01.pdf | 2026-04-24 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 39869902 | 公告本公司115年第1季財務報告董事會召開日期為115年05月08日 | 2026-04-30 | Chinese | ||
| 36181149 | 115年年報及股東會資料 — 2026_3189_20260527FE2.pdf | 2026-04-24 | English | ||
| 36181120 | 115年年報及股東會資料 — 2026_3189_20260527FE1.pdf | 2026-04-24 | English | ||
| 36181103 | 115年年報及股東會資料 — 2026_3189_20260527F13.pdf | 2026-04-24 | Chinese | ||
| 36181086 | 115年年報及股東會資料 — 2026_3189_20260527F02.pdf | 2026-04-24 | Chinese | ||
| 36181047 | 115年年報及股東會資料 — 2026_3189_20260527F01.pdf | 2026-04-24 | Chinese | ||
| 35209183 | 係因本公司有價證券於集中交易市場達公布注意交易資訊標 準,故公布相關財務業務等重大訊息,以利投資人區別瞭解 | 2026-04-22 | Chinese | ||
| 33905615 | 115年03月內部人持股異動(事後) | 2026-04-09 | Chinese | ||
| 33905593 | 115年03月董事會成員及持股 | 2026-04-09 | Chinese | ||
| 33899664 | 本公司董事會決議召開115年股東常會相關事宜公告(新增議案) | 2026-04-09 | Chinese | ||
| 33899657 | 公告本公司董事會決議辦理私募普通股 | 2026-04-09 | Chinese | ||
| 33804153 | 115年03月內部人持股異動(事後) | 2026-04-08 | Chinese | ||
| 33804080 | 115年03月董事會成員及持股 | 2026-04-08 | Chinese | ||
| 34389102 | 115年3月背書保證與資金貸與 | 2026-04-02 | Chinese | ||
| 34389101 | 115年3月營業收入 | 2026-04-02 | Chinese | ||
Market data
Market data not available
Price history
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Kinsus Interconnect Technology Corp. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52304/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52304 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52304 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52304 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52304}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
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// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Kinsus Interconnect Technology Corp. (id: 52304)"
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