HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微独立董事关于第一届董事会第二十一次会议相关事项的独立意见 | 2023-05-25 | Chinese | |
| 晶华微关于2023年限制性股票激励计划内幕信息知情人买卖公司股票情况的自查报告 | 2023-05-25 | Chinese | |
| 晶华微关于聘任高级管理人员的公告 | 2023-05-25 | Chinese | |
| 德恒上海律师事务所关于杭州晶华微电子股份有限公司2022年年度股东大会见证法律意见 | 2023-05-25 | Chinese | |
| 晶华微关于参加2022年度半导体专场集体业绩说明会的公告 | 2023-05-10 | Chinese | |
| 晶华微2022年年度股东大会会议资料 | 2023-05-10 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39465402 | 晶华微独立董事关于第一届董事会第二十一次会议相关事项的独立意见 | 2023-05-25 | Chinese | ||
| 39465389 | 晶华微关于2023年限制性股票激励计划内幕信息知情人买卖公司股票情况的自查报告 | 2023-05-25 | Chinese | ||
| 39465380 | 晶华微关于聘任高级管理人员的公告 | 2023-05-25 | Chinese | ||
| 39465365 | 德恒上海律师事务所关于杭州晶华微电子股份有限公司2022年年度股东大会见证法律意见 | 2023-05-25 | Chinese | ||
| 39465352 | 晶华微关于参加2022年度半导体专场集体业绩说明会的公告 | 2023-05-10 | Chinese | ||
| 39465346 | 晶华微2022年年度股东大会会议资料 | 2023-05-10 | Chinese | ||
| 39465330 | 晶华微监事会关于公司2023年限制性股票激励计划首次授予激励对象名单的审核意见及公示情况说明 | 2023-05-08 | Chinese | ||
| 39465321 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司2022年度持续督导现场检查报告 | 2023-05-05 | Chinese | ||
| 39465308 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司持续督导年度跟踪报告 | 2023-05-05 | Chinese | ||
| 39465300 | 关于杭州晶华微电子股份有限公司非经营性资金占用及其他关联资金往来情况汇总表的专项审计报告 | 2023-04-27 | Chinese | ||
| 39465276 | 晶华微关于2022年度计提资产减值准备的公告 | 2023-04-27 | Chinese | ||
| 39465263 | 晶华微第一届监事会第十四次会议决议公告 | 2023-04-27 | Chinese | ||
| 39465252 | 晶华微关于使用闲置自有资金进行现金管理的公告 | 2023-04-27 | Chinese | ||
| 39465242 | 晶华微监事会关于公司2023年限制性股票激励计划(草案)的核查意见 | 2023-04-27 | Chinese | ||
| 39465235 | 晶华微独立董事关于公司2022 年度对外担保情况的专项说明和独立意见 | 2023-04-27 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.