HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于杭州晶华微电子股份有限公司非经营性资金占用及其他关联资金往来情况汇总表的专项审计报告 | 2026-04-28 | Chinese | |
| 国泰海通证券股份有限公司关于杭州晶华微电子股份有限公司2025年度募集资金存放与使用情况的专项核查意见 | 2026-04-28 | Chinese | |
| 晶华微2025年度独立董事述职报告（何乐年） | 2026-04-28 | Chinese | |
| 晶华微2025年年度报告摘要 | 2026-04-28 | Chinese | |
| 晶华微关于召开2025年年度股东会的通知 | 2026-04-28 | Chinese | |
| 晶华微市值管理制度 | 2026-04-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 39470135 | 关于杭州晶华微电子股份有限公司非经营性资金占用及其他关联资金往来情况汇总表的专项审计报告 | 2026-04-28 | Chinese | ||
| 39470114 | 国泰海通证券股份有限公司关于杭州晶华微电子股份有限公司2025年度募集资金存放与使用情况的专项核查意见 | 2026-04-28 | Chinese | ||
| 39470104 | 晶华微2025年度独立董事述职报告（何乐年） | 2026-04-28 | Chinese | ||
| 39470095 | 晶华微2025年年度报告摘要 | 2026-04-28 | Chinese | ||
| 39470074 | 晶华微关于召开2025年年度股东会的通知 | 2026-04-28 | Chinese | ||
| 39470067 | 晶华微市值管理制度 | 2026-04-28 | Chinese | ||
| 39470063 | 晶华微2026年度“提质增效重回报”行动方案 | 2026-04-28 | Chinese | ||
| 39470054 | 晶华微2026年第一季度报告 | 2026-04-28 | Chinese | ||
| 39470047 | 北京天驰君泰（杭州）律师事务所关于杭州晶华微电子股份有限公司2023年限制性股票激励计划调整授予价格、授予数量及作废部分限制性股票相关事项之法律意见书 | 2026-04-28 | Chinese | ||
| 39470038 | 天健会计师事务所（特殊普通合伙）关于杭州晶华微电子股份有限公司营业收入扣除情况的专项核查意见 | 2026-04-28 | Chinese | ||
| 39469856 | 晶华微2025年度审计报告 | 2026-04-28 | Chinese | ||
| 39469789 | 晶华微董事会审计委员会对会计师事务所履行监督职责情况报告 | 2026-04-28 | Chinese | ||
| 39469781 | 晶华微董事会关于独立董事独立性自查情况的专项报告 | 2026-04-28 | Chinese | ||
| 39469778 | 晶华微关于2026年度董事、高级管理人员薪酬方案的公告 | 2026-04-28 | Chinese | ||
| 39469772 | 晶华微关于深圳晶华智芯微电子有限公司业绩承诺实现情况的公告 | 2026-04-28 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.