HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微2026年第一季度业绩预告的自愿性披露公告 | 2026-04-15 | Chinese | |
| 晶华微关于使用闲置自有资金进行现金管理的公告 | 2026-04-15 | Chinese | |
| 晶华微关于向银行申请综合授信额度的公告 | 2026-04-15 | Chinese | |
| 晶华微2025年度业绩快报公告 | 2026-02-27 | Chinese | |
| 晶华微2025年年度业绩预告 | 2026-01-21 | Chinese | |
| 晶华微关于召开2025年第三季度业绩说明会的公告 | 2025-11-11 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
5 filings
| |||||
| 39469758 | 晶华微2026年第一季度业绩预告的自愿性披露公告 | 2026-04-15 | Chinese | ||
| 39469756 | 晶华微关于使用闲置自有资金进行现金管理的公告 | 2026-04-15 | Chinese | ||
| 39469751 | 晶华微关于向银行申请综合授信额度的公告 | 2026-04-15 | Chinese | ||
| 39469749 | 晶华微2025年度业绩快报公告 | 2026-02-27 | Chinese | ||
| 39469743 | 晶华微2025年年度业绩预告 | 2026-01-21 | Chinese | ||
|
2025
10 filings
| |||||
| 39469735 | 晶华微关于召开2025年第三季度业绩说明会的公告 | 2025-11-11 | Chinese | ||
| 39469725 | 晶华微2025年第三季度报告 | 2025-10-30 | Chinese | ||
| 39469722 | 北京高朋（杭州）律师事务所关于杭州晶华微电子股份有限公司2025年第二次临时股东会之法律意见书 | 2025-10-17 | Chinese | ||
| 39469705 | 晶华微2025年第二次临时股东会决议公告 | 2025-10-17 | Chinese | ||
| 39469694 | 晶华微2025年第二次临时股东会会议资料 | 2025-10-10 | Chinese | ||
| 39469687 | 晶华微关于召开2025年第二次临时股东会的通知 | 2025-09-30 | Chinese | ||
| 39469684 | 晶华微关于调整2024年限制性股票激励计划相关事项的公告 | 2025-09-30 | Chinese | ||
| 39469674 | 晶华微董事会薪酬与考核委员会关于公司2024年限制性股票激励计划预留授予激励对象名单的核查意见（截至授予日） | 2025-09-30 | Chinese | ||
| 39469671 | 北京天驰君泰（杭州）律师事务所关于杭州晶华微电子股份有限公司2024年限制性股票激励计划调整授予价格、授予数量及授予预留部分限制性股票相关事项之法律意见书 | 2025-09-30 | Chinese | ||
| 39469657 | 晶华微关于向2024年限制性股票激励计划激励对象授予预留部分限制性股票的公告 | 2025-09-30 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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