HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微关于续聘2025年度审计机构的公告 | 2025-09-30 | Chinese | |
| 晶华微第二届董事会第二十次会议决议公告 | 2025-09-30 | Chinese | |
| 晶华微2024年限制性股票激励计划预留授予激励对象名单（截至授予日） | 2025-09-30 | Chinese | |
| 国泰海通证券股份有限公司关于杭州晶华微电子股份有限公司2025年半年度持续督导跟踪报告 | 2025-09-11 | Chinese | |
| 晶华微关于开立募集资金专用账户并签订募集资金专户存储四方监管协议的公告 | 2025-09-04 | Chinese | |
| 晶华微关于参加2025年半年度科创板芯片设计行业集体业绩说明会的公告 | 2025-08-29 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 39469643 | 晶华微关于续聘2025年度审计机构的公告 | 2025-09-30 | Chinese | ||
| 39469636 | 晶华微第二届董事会第二十次会议决议公告 | 2025-09-30 | Chinese | ||
| 39469631 | 晶华微2024年限制性股票激励计划预留授予激励对象名单（截至授予日） | 2025-09-30 | Chinese | ||
| 39469627 | 国泰海通证券股份有限公司关于杭州晶华微电子股份有限公司2025年半年度持续督导跟踪报告 | 2025-09-11 | Chinese | ||
| 39469614 | 晶华微关于开立募集资金专用账户并签订募集资金专户存储四方监管协议的公告 | 2025-09-04 | Chinese | ||
| 39469609 | 晶华微关于参加2025年半年度科创板芯片设计行业集体业绩说明会的公告 | 2025-08-29 | Chinese | ||
| 39469603 | 晶华微2025年度提质增效重回报行动方案的半年度评估报告 | 2025-08-22 | Chinese | ||
| 39469594 | 晶华微2025年半年度报告 | 2025-08-22 | Chinese | ||
| 39469591 | 晶华微2025年半年度报告摘要 | 2025-08-22 | Chinese | ||
| 39469588 | 晶华微2025年半年度募集资金存放与使用情况的专项报告 | 2025-08-22 | Chinese | ||
| 39469580 | 晶华微关于完成工商变更登记并换发营业执照的公告 | 2025-08-07 | Chinese | ||
| 39469576 | 晶华微2025年第一次临时股东大会决议公告 | 2025-07-29 | Chinese | ||
| 39469559 | 晶华微关于增设募集资金专用账户的公告 | 2025-07-29 | Chinese | ||
| 39469545 | 晶华微关于使用部分募集资金向全资子公司提供借款以实施募投项目的公告 | 2025-07-29 | Chinese | ||
| 39469538 | 晶华微第二届董事会第十八次会议决议公告 | 2025-07-29 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.