HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微2023年半年度报告 | 2023-08-29 | Chinese | |
| 晶华微关于2023年半年度计提资产减值准备的公告 | 2023-08-29 | Chinese | |
| 晶华微2023年半年度报告摘要 | 2023-08-29 | Chinese | |
| 晶华微关于回购股份事项前十名股东和前十名无限售条件股东持股情况的公告 | 2023-08-24 | Chinese | |
| 晶华微关于参加2023年半年度半导体专场集体业绩说明会的公告 | 2023-08-24 | Chinese | |
| 海通证券股份有限公司关于杭州晶华微电子股份有限公司使用部分超募资金回购股份的核查意见 | 2023-08-18 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39465990 | 晶华微2023年半年度报告 | 2023-08-29 | Chinese | ||
| 39465956 | 晶华微关于2023年半年度计提资产减值准备的公告 | 2023-08-29 | Chinese | ||
| 39465941 | 晶华微2023年半年度报告摘要 | 2023-08-29 | Chinese | ||
| 39465928 | 晶华微关于回购股份事项前十名股东和前十名无限售条件股东持股情况的公告 | 2023-08-24 | Chinese | ||
| 39465914 | 晶华微关于参加2023年半年度半导体专场集体业绩说明会的公告 | 2023-08-24 | Chinese | ||
| 39465906 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司使用部分超募资金回购股份的核查意见 | 2023-08-18 | Chinese | ||
| 39465892 | 晶华微独立董事关于第一届董事会第二十四次会议相关事项的独立意见 | 2023-08-18 | Chinese | ||
| 39465878 | 晶华微第一届董事会第二十四次会议决议公告 | 2023-08-18 | Chinese | ||
| 39465869 | 晶华微关于以集中竞价交易方式回购股份方案的公告 | 2023-08-18 | Chinese | ||
| 39465860 | 晶华微关于公司控股股东、实际控制人、董事长提议公司回购股份的公告.docx | 2023-08-16 | Chinese | ||
| 39465849 | 晶华微第一届监事会第十六次会议决议公告 | 2023-07-25 | Chinese | ||
| 39465840 | 晶华微关于使用暂时闲置募集资金进行现金管理的公告 | 2023-07-25 | Chinese | ||
| 39465820 | 晶华微独立董事关于第一届董事会第二十三次会议相关事项的独立意见 | 2023-07-25 | Chinese | ||
| 39465805 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司使用暂时闲置募集资金进行现金管理的核查意见 | 2023-07-25 | Chinese | ||
| 39465794 | 晶华微首次公开发行部分战略配售限售股上市流通公告 | 2023-07-21 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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