HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微第一届监事会第十八次会议决议公告 | 2023-10-27 | Chinese | |
| 晶华微独立董事关于第一届董事会第二十六次会议相关事项的独立意见 | 2023-10-27 | Chinese | |
| 晶华微关于2023年前三季度计提资产减值准备的公告 | 2023-10-27 | Chinese | |
| 晶华微2023年第三季度报告 | 2023-10-27 | Chinese | |
| 晶华微关于公司及相关人员收到浙江证监局警示函的公告 | 2023-10-13 | Chinese | |
| 晶华微关于以集中竞价交易方式回购公司股份的进展公告 | 2023-10-09 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39466235 | 晶华微第一届监事会第十八次会议决议公告 | 2023-10-27 | Chinese | ||
| 39466216 | 晶华微独立董事关于第一届董事会第二十六次会议相关事项的独立意见 | 2023-10-27 | Chinese | ||
| 39466210 | 晶华微关于2023年前三季度计提资产减值准备的公告 | 2023-10-27 | Chinese | ||
| 39466203 | 晶华微2023年第三季度报告 | 2023-10-27 | Chinese | ||
| 39466193 | 晶华微关于公司及相关人员收到浙江证监局警示函的公告 | 2023-10-13 | Chinese | ||
| 39466180 | 晶华微关于以集中竞价交易方式回购公司股份的进展公告 | 2023-10-09 | Chinese | ||
| 39466168 | 晶华微关于以集中竞价交易方式首次回购公司股份的公告 | 2023-09-21 | Chinese | ||
| 39466153 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司2023年持续督导半年度跟踪报告 | 2023-09-15 | Chinese | ||
| 39466122 | 晶华微关于以集中竞价交易方式回购公司股份的回购报告书 | 2023-08-30 | Chinese | ||
| 39466104 | 晶华微2022年半年度报告（更正版） | 2023-08-29 | Chinese | ||
| 39466048 | 晶华微2022年第三季度报告（更正版） | 2023-08-29 | Chinese | ||
| 39466035 | 晶华微关于前期会计差错更正及定期报告更正的公告 | 2023-08-29 | Chinese | ||
| 39466023 | 晶华微独立董事关于第一届董事会第二十五次会议相关事项的独立意见 | 2023-08-29 | Chinese | ||
| 39466013 | 晶华微第一届监事会第十七次会议决议公告 | 2023-08-29 | Chinese | ||
| 39466002 | 晶华微2023年半年度募集资金存放与使用情况的专项报告 | 2023-08-29 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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