HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微公司章程 | 2023-04-27 | Chinese | |
| 晶华微2022年年度报告摘要 | 2023-04-27 | Chinese | |
| 晶华微关于前期会计差错更正及定期报告更正的公告 | 2023-04-27 | Chinese | |
| 杭州晶华微电子股份有限公司2023年限制性股票激励计划（草案）摘要公告 | 2023-04-27 | Chinese | |
| 晶华微2022年度董事会审计委员会履职情况报告 | 2023-04-27 | Chinese | |
| 晶华微2022年度募集资金存放与使用情况的专项报告 | 2023-04-27 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39465227 | 晶华微公司章程 | 2023-04-27 | Chinese | ||
| 39465212 | 晶华微2022年年度报告摘要 | 2023-04-27 | Chinese | ||
| 39465191 | 晶华微关于前期会计差错更正及定期报告更正的公告 | 2023-04-27 | Chinese | ||
| 39465188 | 杭州晶华微电子股份有限公司2023年限制性股票激励计划（草案）摘要公告 | 2023-04-27 | Chinese | ||
| 39465174 | 晶华微2022年度董事会审计委员会履职情况报告 | 2023-04-27 | Chinese | ||
| 39465169 | 晶华微2022年度募集资金存放与使用情况的专项报告 | 2023-04-27 | Chinese | ||
| 39465142 | 晶华微关于召开2022年年度股东大会的通知 | 2023-04-27 | Chinese | ||
| 39465121 | 晶华微2023年限制性股票激励计划首次授予激励对象名单 | 2023-04-27 | Chinese | ||
| 39465114 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司追认使用部分暂时闲置募集资金进行现金管理事项的核查意见 | 2023-04-27 | Chinese | ||
| 39465105 | 晶华微2022年年度报告 | 2023-04-27 | Chinese | ||
| 39464921 | 晶华微2022年半年度报告（修订版） | 2023-04-27 | Chinese | ||
| 39464860 | 天健会计师事务所(特殊普通合伙)关于杭州晶华微电子股份有限公司2022年度募集资金年度存放与使用情况鉴证报告 | 2023-04-27 | Chinese | ||
| 39464826 | 杭州晶华微电子股份有限公司2023年限制性股票激励计划（草案） | 2023-04-27 | Chinese | ||
| 39464799 | 晶华微关于追认使用部分暂时闲置募集资金进行现金管理的公告 | 2023-04-27 | Chinese | ||
| 39464775 | 晶华微2022年第三季度报告（修订版） | 2023-04-27 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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