HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微关于2023年度利润分配暨资本公积转增股本预案的公告 | 2024-04-26 | Chinese | |
| 晶华微2023年度独立董事述职报告（王明琳） | 2024-04-26 | Chinese | |
| 晶华微2023年度会计师事务所履职情况评估报告 | 2024-04-26 | Chinese | |
| 晶华微2023年度募集资金存放与使用情况的专项报告 | 2024-04-26 | Chinese | |
| 天健会计师事务所（特殊普通合伙）关于杭州晶华微电子股份有限公司内部控制审计报告 | 2024-04-26 | Chinese | |
| 晶华微2023年度董事会审计委员会履职情况报告 | 2024-04-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39467046 | 晶华微关于2023年度利润分配暨资本公积转增股本预案的公告 | 2024-04-26 | Chinese | ||
| 39467029 | 晶华微2023年度独立董事述职报告（王明琳） | 2024-04-26 | Chinese | ||
| 39467021 | 晶华微2023年度会计师事务所履职情况评估报告 | 2024-04-26 | Chinese | ||
| 39467019 | 晶华微2023年度募集资金存放与使用情况的专项报告 | 2024-04-26 | Chinese | ||
| 39467008 | 天健会计师事务所（特殊普通合伙）关于杭州晶华微电子股份有限公司内部控制审计报告 | 2024-04-26 | Chinese | ||
| 39466977 | 晶华微2023年度董事会审计委员会履职情况报告 | 2024-04-26 | Chinese | ||
| 39466962 | 关于杭州晶华微电子股份有限公司非经营性资金占用及其他关联资金往来情况汇总表的专项审计报告 | 2024-04-26 | Chinese | ||
| 39466951 | 晶华微2023年度内部控制评价报告 | 2024-04-26 | Chinese | ||
| 39466928 | 晶华微关于召开2023年年度股东大会的通知 | 2024-04-26 | Chinese | ||
| 39466903 | 晶华微董事会关于独立董事独立性自查情况的专项报告 | 2024-04-26 | Chinese | ||
| 39466898 | 晶华微2023年年度报告摘要 | 2024-04-26 | Chinese | ||
| 39466886 | 晶华微关于购买董监高责任险的公告 | 2024-04-26 | Chinese | ||
| 39466880 | 晶华微第二届董事会第四次会议决议公告 | 2024-04-26 | Chinese | ||
| 39466870 | 晶华微2024年度“提质增效重回报”行动方案 | 2024-04-26 | Chinese | ||
| 39466845 | 晶华微会计师事务所选聘管理制度 | 2024-04-26 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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