HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微2023年年度股东大会会议资料 | 2024-05-10 | Chinese | |
| 海通证券股份有限公司关于杭州晶华微电子股份有限公司2023年度持续督导现场检查报告 | 2024-05-07 | Chinese | |
| 海通证券股份有限公司关于杭州晶华微电子股份有限公司2023年度持续督导年度跟踪报告 | 2024-05-07 | Chinese | |
| 晶华微关于以集中竞价交易方式回购公司股份的进展公告 | 2024-05-06 | Chinese | |
| 晶华微关于参加2023年度芯片设计专场集体业绩说明会的公告 | 2024-05-06 | Chinese | |
| 晶华微2023年度独立董事述职报告（周健军） | 2024-04-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39467448 | 晶华微2023年年度股东大会会议资料 | 2024-05-10 | Chinese | ||
| 39467436 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司2023年度持续督导现场检查报告 | 2024-05-07 | Chinese | ||
| 39467429 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司2023年度持续督导年度跟踪报告 | 2024-05-07 | Chinese | ||
| 39467422 | 晶华微关于以集中竞价交易方式回购公司股份的进展公告 | 2024-05-06 | Chinese | ||
| 39467405 | 晶华微关于参加2023年度芯片设计专场集体业绩说明会的公告 | 2024-05-06 | Chinese | ||
| 39467398 | 晶华微2023年度独立董事述职报告（周健军） | 2024-04-26 | Chinese | ||
| 39467389 | 晶华微2023年度审计报告 | 2024-04-26 | Chinese | ||
| 39467100 | 晶华微2023年度独立董事述职报告（余景选） | 2024-04-26 | Chinese | ||
| 39467094 | 晶华微第二届监事会第二次会议决议公告 | 2024-04-26 | Chinese | ||
| 39467084 | 晶华微关于使用闲置自有资金进行现金管理的公告 | 2024-04-26 | Chinese | ||
| 39467076 | 晶华微关于2023年度计提资产减值准备的公告 | 2024-04-26 | Chinese | ||
| 39467068 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司使用部分超募资金永久补充流动资金的核查意见 | 2024-04-26 | Chinese | ||
| 39467059 | 晶华微关于向银行申请综合授信额度的公告 | 2024-04-26 | Chinese | ||
| 39467054 | 晶华微关于使用部分超募资金永久补充流动资金的公告 | 2024-04-26 | Chinese | ||
| 39467046 | 晶华微关于2023年度利润分配暨资本公积转增股本预案的公告 | 2024-04-26 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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