HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶华微关于股份回购实施结果暨股份变动的公告 | 2024-07-31 | Chinese | |
| 晶华微关于实施2023年年度权益分派后调整回购股份价格上限的公告 | 2024-07-24 | Chinese | |
| 晶华微关于使用暂时闲置募集资金进行现金管理的公告 | 2024-07-23 | Chinese | |
| 晶华微第二届监事会第三次会议决议公告 | 2024-07-23 | Chinese | |
| 海通证券股份有限公司关于杭州晶华微电子股份有限公司使用暂时闲置募集资金进行现金管理的核查意见 | 2024-07-23 | Chinese | |
| 晶华微首次公开发行部分战略配售限售股上市流通公告 | 2024-07-19 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39467623 | 晶华微关于股份回购实施结果暨股份变动的公告 | 2024-07-31 | Chinese | ||
| 39467604 | 晶华微关于实施2023年年度权益分派后调整回购股份价格上限的公告 | 2024-07-24 | Chinese | ||
| 39467599 | 晶华微关于使用暂时闲置募集资金进行现金管理的公告 | 2024-07-23 | Chinese | ||
| 39467593 | 晶华微第二届监事会第三次会议决议公告 | 2024-07-23 | Chinese | ||
| 39467586 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司使用暂时闲置募集资金进行现金管理的核查意见 | 2024-07-23 | Chinese | ||
| 39467567 | 晶华微首次公开发行部分战略配售限售股上市流通公告 | 2024-07-19 | Chinese | ||
| 39467554 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司首次公开发行部分战略配售限售股上市流通的核查意见 | 2024-07-19 | Chinese | ||
| 39467547 | 晶华微2023年年度权益分派实施结果暨股份上市公告 | 2024-07-11 | Chinese | ||
| 39467540 | 晶华微2023年年度权益分派实施公告 | 2024-07-05 | Chinese | ||
| 39467522 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司差异化权益分派特殊除权除息事项的核查意见 | 2024-07-05 | Chinese | ||
| 39467516 | 晶华微关于以集中竞价交易方式回购公司股份的进展公告 | 2024-07-01 | Chinese | ||
| 39467506 | 晶华微首次公开发行部分限售股上市流通公告 | 2024-06-14 | Chinese | ||
| 39467489 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司首次公开发行部分限售股上市流通的核查意见 | 2024-06-14 | Chinese | ||
| 39467482 | 晶华微关于以集中竞价交易方式回购公司股份的进展公告 | 2024-06-04 | Chinese | ||
| 39467475 | 晶华微2023年年度股东大会决议公告 | 2024-05-21 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.